The semiconductor industry is the core of modern technology, and advancements in chip manufacturing processes have always been the key to improving the performance of electronic products. In recent years, TSMC and Samsung have engaged in fierce competition in the advanced process field. The latest data shows that TSMC's 2nm process yield has broken through the 90% mark, far exceeding industry expectations, while its 3nm technology continues to operate at full capacity with an expanding customer base. This article will delve into TSMC's breakthrough in the 2nm process and the latest status of the 3nm process, while also comparing Samsung's progress in this area.

TSMC's Breakthrough in the 2nm Process

TSMC has always maintained a leading position in advanced process technology. Reports indicate that the yield of TSMC's 2nm process storage products has exceeded 90%. This achievement marks another significant step for TSMC in the field of semiconductor manufacturing. The high yield of the 2nm process not only means higher production efficiency but also provides a solid foundation for future high-performance computing and artificial intelligence applications.

TSMC's capacity layout is also continuously being optimized. Its factory in Arizona, USA, has begun producing chips and is expected to mass-produce NVIDIA's AI chips by the end of 2025. This move not only meets the needs of major US-based tech giants but also further consolidates TSMC's position in the global semiconductor market. The capacity utilization rate of the Arizona factory is expected to reach full load in a short period of time, thanks to orders from major customers such as NVIDIA, Apple, Qualcomm, AMD, and Broadcom.

Moreover, TSMC's cooperation with top global tech companies continues to deepen. Apple, one of TSMC's important customers, will be the biggest beneficiary of the Arizona factory. In addition, NVIDIA's AI chips are undergoing process validation at TSMC's US factory and are expected to enter production by the end of this year. These partnerships not only bring stable orders to TSMC but also drive its continuous technological progress.

The Current Status of TSMC's 3nm Process

TSMC's 3nm process technology has become relatively mature, with a yield exceeding 90%. This enables TSMC to provide stable and high-performance chip manufacturing services to customers. Its third-generation 3nm (N3P) process has attracted numerous customers, including Apple, Qualcomm, NVIDIA, and MediaTek, who are expected to gradually transition to TSMC's 2nm process from 2026 onwards.

TSMC's leading position in the 3nm process gives it an advantage in terms of market share and customer trust. Its high yield and mature technology have attracted a large number of orders, especially long-term cooperation orders from major tech companies such as Apple and Qualcomm. This trust relationship not only brings stable revenue to TSMC but also lays the foundation for its future process upgrades.

The Current Status of Samsung's 3nm Process

In stark contrast to TSMC's smooth progress, Samsung faces many challenges in the 3nm process. According to South Korean media reports, Samsung's 3nm process yield is only 50%, and after three years of mass production, there has been no significant improvement. This makes it difficult for Samsung to win the trust of major tech companies. For example, Google's Tensor G5 chip has already switched to TSMC's 3nm process, and Qualcomm and AMD are also more inclined to choose TSMC's capacity.

Despite the slow progress in the 3nm process, Samsung is still trying to reduce costs through internal applications. For example, Samsung plans to use its own Exynos 2500 chip in its upcoming Galaxy Z Flip 7, which will be manufactured on Samsung's 3nm node. This move is more about cost control than a technological showcase.

Conevo IC Distributor and Popular IC Models

Conevo, a leading global distributor of integrated circuits (ICs), offers a wide range of high-quality semiconductor products to meet diverse customer needs. With a commitment to providing reliable and innovative solutions, Conevo ensure the availability of the latest and most advanced ICs. Here are some of the popular IC models currently recommended by Conevo:

● NXP USA Inc. 74HC4067PW,112: A 16-channel analog multiplexer/demultiplexer with low on-resistance and excellent signal integrity. Ideal for signal routing in communication systems and sensor interfacing.

● Texas Instruments TLV70433DBVR: A low-dropout linear regulator with high PSRR and low quiescent current. Suitable for power management in portable devices and low-power systems.

● Analog Devices Inc. AD8137YRZ: A high-speed, dual-channel video amplifier with excellent dynamic performance. Perfect for video signal processing and high-frequency signal conditioning.

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