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  • NEWS CENTER
    • ASML Strategic Planning: Potential Expansion into Advanced Packaging

      ASML Strategic Planning: Potential Expansion into Advanced Packaging

      Dutch semiconductor equipment giant ASML is formulating a long-term strategy to extend its business footprint from the extreme ultraviolet (EUV) lithography domain into the advanced packaging and chip bonding equipment markets. In an interview, ASML Chief Technology Officer Marco Pieters explicitly ...

      Friday 06 March, 2026

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    • Hot Chip Guide: In-Depth Analysis of IC Component

      Hot Chip Guide: In-Depth Analysis of IC Component

      From the real-time responsiveness of microcontrollersto the parallel acceleration of FPGAs, from the weak signal capture of precision sensors to the efficient energy conversion of power devices, each category of chip plays an irreplaceable role in specific technical scenarios. This article presents ...

      Thursday 05 March, 2026

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    • KEMET Implements Third Tantalum Capacitor Price Hike Within Nine Months

      KEMET Implements Third Tantalum Capacitor Price Hike Within Nine Months

      In early March 2026, KEMET, a subsidiary of passive component giant Yageo, formally issued price increase notification letters to customers, announcing adjustments to its KO-CAP polymer tantalum capacitor product line, specifically the T523 series. The new pricing will take effect on April 1, 2026. ...

      Wednesday 04 March, 2026

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