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TI Launches Second Comprehensive Price Increase
Texas Instruments (TI), the global leader in analog chips, has announced that it will launch its second comprehensive price increase action on April 1, 2026. The price adjustment is expected to range between 15% and 85%, potentially covering all customer segments and involving multiple core product ...
Tuesday 10 March, 2026
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Merger: DENSO Plans ¥1.3 Trillion Acquisition of ROHM
In March 2026, Japanese automotive components supplier DENSO formally submitted a full acquisition proposal to semiconductor manufacturer ROHM, with the transaction valued at approximately ¥1.3 trillion (around $8.2 billion). Should the deal materialize, the two companies would form a domestic Japan...
Monday 09 March, 2026
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ASML Strategic Planning: Potential Expansion into Advanced Packaging
Dutch semiconductor equipment giant ASML is formulating a long-term strategy to extend its business footprint from the extreme ultraviolet (EUV) lithography domain into the advanced packaging and chip bonding equipment markets. In an interview, ASML Chief Technology Officer Marco Pieters explicitly ...
Friday 06 March, 2026
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