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Three core components of power electronics: MOSFET, BJT, and IGBT
In modern power electronic systems, MOSFETs, BJTs, and IGBTs constitute the three pillars of power semiconductor devices. Their unique structures and operating principles determine their respective advantages and limitations in different application scenarios, collectively driving the advancement of...
Friday 20 March, 2026
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Middle East Conflict Triggers Risk of Surging Chip Material Costs
In March 2026, as the Middle East war entered its third week, the global semiconductor industry is facing a potential supply chain crisis. SEMI Taiwan issued a statement on March 18, noting that Taiwanese semiconductor companies currently face no immediate risk of disruption to basic chemicals or ra...
Thursday 19 March, 2026
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Break the Ice! NVIDIA Resumes H200 Production for China
At the annual GTC held in San Jose, California on March 17, 2026, Nvidia CEO Jensen Huang announced that the company has received purchase orders from Chinese customers and is "restarting production" of the H200 AI accelerator specifically for the China market. Huang confirmed to CNBC that...
Wednesday 18 March, 2026
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