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SK Hynix Begins Mass Production of 192GB SOCAMM2
On April 20, 2026, SK Hynix announced the formal commencement of mass production for its 192GB SOCAMM2 product, built upon sixth-generation 1c LPDDR5X low-power DRAM. This marks the industry's first SOCAMM2 module employing the advanced 1c process node, signifying a substantive breakthrough in t...
Monday 20 April, 2026
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ASML Capacity Plan: Doubling EUV Lithography Output by 2027
Faced with the explosive surge in chip demand ignited by artificial intelligence (AI), global semiconductor equipment giant ASML has formally established its "capacity doubling" strategy. Chief Executive Officer Christophe Fouquet explicitly stated that the company will leverage the dual e...
Friday 17 April, 2026
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Kyocera's Strategic Acquisition of Ushio's Semiconductor Laser Business
Japanese multinational technology corporation Kyocera Corporation officially announced on April 14, 2026, that it has entered into a share purchase agreement with Ushio Inc. to acquire Ushio's semiconductor laser device business. Under the agreement, Ushio will transfer this business to a newly ...
Thursday 16 April, 2026
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