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UMC's Dual-Track Advanced Packaging Strategy: Silicon Interposer and TGV Tech
In the fast-evolving landscape of advanced packaging, UMC has charted a distinctive course. Rather than following a single path, the foundry is simultaneously expanding its silicon interposer capacity and positioning itself for next-generation TGV (Through-Glass Via) packaging technology—a dual-pron...
Monday 20 July, 2026
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Intel First to Achieve High-NA EUV Mass Production for Logic Chips
On July 15, 2026, ASML officially announced that Intel Foundry has successfully utilized ASML's high-numerical-aperture extreme ultraviolet (High-NA EUV) lithography technology to mass-produce certain processors from the third-generation Core Ultra series, codenamed "Panther Lake," on ...
Friday 17 July, 2026
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Samsung's Foundry Business Achieves First Monthly Profit in Three Years
In June 2026, Samsung Electronics' foundry division recorded a monthly break-even point, marking its first monthly profit since 2023. HBM Demand and 4nm Yield ImprovementThe core drivers behind this turnaround are two structural improvements. The first is the continued expansion of shipment...
Thursday 16 July, 2026
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