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Merger: DENSO Plans ¥1.3 Trillion Acquisition of ROHM
In March 2026, Japanese automotive components supplier DENSO formally submitted a full acquisition proposal to semiconductor manufacturer ROHM, with the transaction valued at approximately ¥1.3 trillion (around $8.2 billion). Should the deal materialize, the two companies would form a domestic Japan...
Monday 09 March, 2026
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ASML Strategic Planning: Potential Expansion into Advanced Packaging
Dutch semiconductor equipment giant ASML is formulating a long-term strategy to extend its business footprint from the extreme ultraviolet (EUV) lithography domain into the advanced packaging and chip bonding equipment markets. In an interview, ASML Chief Technology Officer Marco Pieters explicitly ...
Friday 06 March, 2026
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Hot Chip Guide: In-Depth Analysis of IC Component
From the real-time responsiveness of microcontrollersto the parallel acceleration of FPGAs, from the weak signal capture of precision sensors to the efficient energy conversion of power devices, each category of chip plays an irreplaceable role in specific technical scenarios. This article presents ...
Thursday 05 March, 2026
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