Texas Instruments (TI), the global leader in analog chips, has announced that it will launch its second comprehensive price increase action on April 1, 2026. The price adjustment is expected to range between 15% and 85%, potentially covering all customer segments and involving multiple core product ...
In March 2026, Japanese automotive components supplier DENSO formally submitted a full acquisition proposal to semiconductor manufacturer ROHM, with the transaction valued at approximately ¥1.3 trillion (around $8.2 billion). Should the deal materialize, the two companies would form a domestic Japan...
Dutch semiconductor equipment giant ASML is formulating a long-term strategy to extend its business footprint from the extreme ultraviolet (EUV) lithography domain into the advanced packaging and chip bonding equipment markets. In an interview, ASML Chief Technology Officer Marco Pieters explicitly ...
From the real-time responsiveness of microcontrollersto the parallel acceleration of FPGAs, from the weak signal capture of precision sensors to the efficient energy conversion of power devices, each category of chip plays an irreplaceable role in specific technical scenarios. This article presents ...
In early March 2026, KEMET, a subsidiary of passive component giant Yageo, formally issued price increase notification letters to customers, announcing adjustments to its KO-CAP polymer tantalum capacitor product line, specifically the T523 series. The new pricing will take effect on April 1, 2026. ...
On February 26, 2026, SmartSens, a leading domestic CMOS image sensor (CIS) company in China, officially issued price increase notifications to its partners, announcing differentiated price adjustments for select CMOS products in its two core application areas-smart security and ...
In modern electronic systems, electrical isolation serves as a fundamental technology ensuring equipment reliability and personnel safety. The Digital Isolator, a high-performance semiconductor device fabricated with CMOS technology, enables secure transmission of digital signals through semiconduct...