Storage giant Micron Technology has made significant progress in the High Bandwidth Memory (HBM) field. In the latest quarterly earnings call, Micron's President and CEO Sanjay Mehrotra announced that the company has shipped the industry's fastest 11 Gbps HBM4 samples to customers. The product offers a bandwidth of over 2.8 TB/s, far exceeding industry standards. Micron's HBM4 12-Hi DRAM solution is on schedule, aimed at accelerating the development of customer platforms. Micron believes that its HBM4 product will outperform all competitors in terms of performance and efficiency, providing industry-leading performance and best-in-class power efficiency.

Technological Innovation and Market Reaction

Micron's HBM4 product employs advanced 1-gamma DRAM technology and an innovative HBM4 design, combined with advanced CMOS base chips and advanced packaging technologies. The integration of these technologies enables Micron to achieve speeds of over 11 Gbps and a bandwidth of 2.8 TB/s, meeting customers' demands for high-performance memory. In addition, Micron has announced a partnership with TSMC, the leading foundry manufacturer, to jointly produce the base logic chips for HBM4E memory. This collaboration will lay the foundation for future cutting-edge computing, with HBM4E expected to enter mass production in 2027.

Micron has sent its HBM4 samples to several customers, with the first shipments expected in the second quarter of 2026, and production will gradually ramp up in the second half of the year. This progress refutes recent rumors about failing to meet Nvidia's standards. Micron's HBM market share is steadily growing, and it is expected that its HBM market share will align with its overall DRAM market share. As AI technology continues to evolve, the demand for high-performance memory will keep increasing, and Micron's HBM4 product will play a significant role in this market.

Industry Impact and Competition

Micron's HBM4 product not only leads in performance but also excels in power efficiency. This gives Micron a competitive edge over rivals such as Samsung and SK Hynix in the market. As the HBM market continues to expand, it is projected to reach a market size of 100 billion US dollars by 2030. Micron's HBM4 product will provide significant support for the growth of this market and also bring new growth opportunities for the company.

Micron Technology has established its leadership in next-generation HBM technology through the technological innovation and market positioning of its HBM4 product. The collaboration with TSMC will further enhance its competitiveness in the high-end memory market. With the widespread application of AI technology, Micron's HBM4 product will not only meet market demands but also drive the memory industry towards higher performance and greater capacity.

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