On October 31, 2025, SCREEN Holdings (hereinafter referred to as SCREEN) announced that it had completed the acquisition of Nikon's wafer bonding technology R&D business on September 30 of the same year. This acquisition is a significant step in SCREEN's three-year mid-term management plan, "Value Further Enhancement 2026," aimed at expanding its semiconductor advanced packaging business through growth investments. SCREEN believes that this field holds tremendous growth potential, and thus has decided to strengthen its competitiveness in this area by acquiring Nikon's relevant technologies.

Technology Integration and Collaboration Opportunities

In the field of advanced semiconductor packaging, the increasing demand for space-saving and low-power consumption is driving higher precision requirements for wafer bonding technology. SCREEN has identified advanced semiconductor packaging as a key development direction. In addition to selling direct imaging equipment and coating and drying devices, the company is also developing and applying low-temperature wafer bonding technology. Through this acquisition, Nikon's ultra-high precision interconnection technology and expertise will be integrated with SCREEN's existing technologies, with the goal of developing the world's highest level of interconnection technology and establishing a leading position in this field.

The global semiconductor industry is moving towards smaller process nodes, such as sub-2-nanometer nodes, which pose higher requirements for manufacturing precision and cleanliness. Through its collaboration with Nikon, SCREEN will be better positioned to meet these challenges and occupy a more advantageous position in the advanced semiconductor packaging market. In addition, SCREEN is also collaborating with other industry leaders. For example, it is working with IBM to develop cleaning technology for High-NA extreme ultraviolet (EUV) lithography, further enhancing its technological capabilities in the semiconductor manufacturing field.

SCREEN's Performance and Future Outlook

In the third quarter of 2025, SCREEN achieved record revenues of 459.9 billion yen, a year-on-year increase of 32.2%. The semiconductor production equipment (SPE) business, particularly in China and Taiwan, performed exceptionally well. SCREEN forecasts that its full-year revenues will reach 616 billion yen, with operating profits of 126 billion yen. The acquisition of Nikon's wafer bonding technology R&D business will further consolidate SCREEN's position in the semiconductor equipment market and lay a solid foundation for its future growth.

In summary, SCREEN's acquisition of Nikon's wafer bonding technology R&D business is not only an important step in its own strategic development but also has a positive impact on the entire semiconductor industry. By integrating Nikon's advanced technologies, SCREEN will be better able to meet the market's demand for high-performance semiconductor packaging and drive technological progress in the industry. Looking to the future, SCREEN will continue to enhance its competitiveness in the global semiconductor market through technological innovation and strategic cooperation, contributing to the sustainable development of the industry.

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