On March 31, 2026, Kioxia issued its latest End-of-Life (EOL) notification to customers, announcing its gradual withdrawal from the traditional Floating Gate 2D NAND flash memory market. This marks the second discontinuation announcement from Kioxia within two weeks, following its mid-March notice regarding TSOP packaged products. Under the latest notification, the deadline for customers to submit final procurement forecasts is September 30, 2026, with final shipments of all affected products continuing through December 31, 2028.

Scope of Discontinued Products and Technical Specifications

The discontinuation covers an exceptionally broad range of products, encompassing nearly Kioxia's entire traditional NAND portfolio:

● Process Nodes: Floating Gate 2D NAND at 32nm, 24nm, and 15nm process technologies

● Early-Generation 3D NAND: Including select products based on early BiCS architecture

● Cell Types: All mainstream types including SLC (Single-Level Cell), MLC (Multi-Level Cell), and TLC (Triple-Level Cell)

● Product Form Factors: Nearly all packaging and supply formats, including Raw Wafer, BGA packages, TSOP packages, eMMC, UFS, and standard SD cards

Notably, the 32nm SLC NAND has been in mass production since 2009, 24nm MLC NAND since 2010, and 15nm MLC and TLC NAND since 2014—these technology platforms have been in service for over a decade.

Prior Discontinuation Preparations

This comprehensive discontinuation represents a continuation of Kioxia's recent product line adjustments. As early as March 16, 2026, Kioxia had already issued a notification announcing that, due to capacity and substrate supply constraints, it would cease production of 8Gb to 64Gb MLC NAND flash products in Thin Small Outline Package (TSOP) format.

TSOP packaging is primarily used for low-capacity MLC NAND memory, widely deployed in industrial control, automotive equipment, medical devices, and network communications—fields with stringent requirements for reliability and longevity. The final order deadline for this product category is September 15, 2026, with final shipments scheduled for March 15, 2027.

Market Landscape

According to TrendForce analysis, as major NAND manufacturers including Samsung, Kioxia, SK Hynix, and Micron progressively reduce or halt MLC NAND production, global MLC NAND Flash capacity in 2026 is projected to decrease by 41.7% year-over-year, further widening the supply-demand gap. Samsung had previously announced in March 2025 that its MLC NAND products would complete final shipments by June 2026.

Currently, 2D NAND flash memory is primarily utilized in long-lifecycle specialty storage applications such as automotive equipment, consumer electronics, embedded systems, and industrial automation. Kioxia's complete exit means these sectors will face supply chain restructuring pressures, requiring customers to complete migration to 3D NAND or alternative solutions before the end of 2028.

Electronic Components Supply - CONEVO

CONEVO, as a leading diversified electronic component distributor, focuses on core product lines such as FPGA, MCU, DSP, data converters, and MLCC. It provides comprehensive support to OEM and EMS companies in the global aerospace, automotive electronics, medical equipment, industrial control, and consumer electronics sectors. Here are some of the selected IC components from CONEVO.

● IRF640NLPBF: Infineon 100V N-channel power MOSFET, with a continuous drain current capacity of 18A, suitable for high-voltage and high-current applications such as switching power supplies and motor drives.

● TPS62122DRVR: TI 3MHz synchronous buck converter, supporting 300mA output current, specifically designed for efficient power management solutions in portable devices and battery-powered systems.

● ADM2582EBRWZ: ADI isolated RS-485/RS-422 transceiver, integrating isolation power supply and signal isolation functions, suitable for industrial automation and harsh environments requiring long-distance data transmission.

Website: www.conevoelec.com

Email: info@conevoelec.com