Recently, NVIDIA officially announced the signing of a multi-year technology cooperation agreement with SK Hynix, under which both parties will jointly advance the development of next-generation memory technologies for global AI data centers. This collaboration not only aims to ensure a stable supply of advanced memory, but also addresses multiple challenges including lengthy development cycles, advanced manufacturing processes, and capital investments, thereby accelerating the construction of global AI factories.

Under the agreement, SK Hynix will serve as a core partner and deeply engage in memory development for several of NVIDIA's key platforms. These specifically include the Vera Rubin AI supercomputer, the Vera CPU, RTX Spark-powered personal computers, and the Jetson Thor robotics computing platform. This arrangement demonstrates that the partnership has expanded from a single data center scenario to diverse domains encompassing personal terminals and embodied intelligence, forming cross-layer technical synergy.

In terms of cooperation mechanisms, SK Hynix will leverage NVIDIA's Omniverse, OpenUSD scene optimization technologies, and NVIDIA cuOpt tools to drive AI factory technologies into automated chip manufacturing production lines. During his meeting with SK Group Chairman Chey Tae-won, NVIDIA CEO Jensen Huang explicitly stated that SK Hynix has always been NVIDIA's largest memory chip partner, and this position will be further consolidated in the future. Currently, NVIDIA's annual procurement from SK Hynix has already reached billions of dollars, with significant growth expected under the new agreement framework.

On the technical front, both parties are focusing on the joint development and supply of the sixth-generation high-bandwidth memory, HBM4. As a key component of the Vera Rubin accelerator, HBM4 delivers higher transfer rates and greater capacity, effectively alleviating data bottlenecks during AI training and inference. Additionally, SK Hynix showcased its full portfolio of AI memory solutions—including HBM4, HBM3E, SOCAMM2, and liquid-cooled eSSD—during GTC 2026, highlighting the depth of its technical reserves.

Through long-term technical collaboration and capacity locking, NVIDIA and SK Hynix are jointly building a comprehensive AI memory ecosystem spanning from data centers to edge devices, laying a solid hardware foundation for next-generation intelligent computing.

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