TI's TPSM series power modules employ a highly integrated synchronous buck architecture that combines controllers, power MOSFETs, inductors, and passive components into a single package. This significantly streamlines power supply design and reduces PCB footprint. The TPSM family covers a complete power spectrum with input voltages from 2.4V to 65V and output currents from 600mA to 6A, making them core power solutions for industrial automation, communications infrastructure, and automotive electronics.

TPSM Series Core Advantages

Integration means simplification. In traditional DC-DC designs, engineers must independently select inductors, MOSFETs, compensation networks, and repeatedly verify loop stability. TPSM modules, however, pre‑integrate all critical components inside the package – users only need to add input/output capacitors to complete the power design. This design philosophy delivers benefits across multiple dimensions:

●Greatly improved design efficiency. The modular approach eliminates the tedious processes of magnetic component selection and loop compensation; the complete solution requires only four external components to function.

●Better performance and higher reliability. Internal components are rigorously matched and optimized, enabling higher efficiency and superior EMI performance. Several models have obtained functional safety‑related certifications.

●Continuous packaging technology evolution. TI has built a clear technology roadmap: MicroSiP™ targets extreme miniaturization, HotRod™ QFN balances thermal performance and low EMI, while MagPack™ represents the latest generation of integration – through bond‑wire‑less packaging and shielded inductor technology, it reduces solution size while effectively suppressing electromagnetic interference.

Product Portfolio and Selection Guide

The following table lists representative best‑selling TPSM series models currently available on the market, covering three categories: low‑voltage high‑density, medium‑voltage general‑purpose, and high‑voltage wide‑input.

Faced with the rich TPSM product portfolio, a sensible selection should focus on three core dimensions:

1. Input voltage determines whether the module can adapt to the target power rail. For low‑voltage applications (2.4V–5.5V), choose TPSM82821 or TPSM82866; for 12V/24V industrial buses, select TPSM33625 or TPSM63606; for high‑voltage industrial and telecom applications (60V–65V), TPSM560R6 and TPSM365R6 are the appropriate choices.

2. Output current should reserve sufficient margin based on peak load requirements. For wearable devices, the 1A TPSM82821 is suitable; for FPGA core power, the 6A TPSM82866 or TPSM63606 is needed.

3. Package size and power density are particularly critical when PCB space is constrained. TPSM82821 and TPSM82866 are the ultimate compact choices.

Additionally, for battery‑powered devices, priority should be given to quiescent current (e.g., TPSM365R6's 4µA no‑load IQ, TPSM33625's 1.5µA standby IQ). For applications with stringent EMI requirements, models with spread‑spectrum modulation, shielded inductors, or ZEN 1 switch technology are preferred.

Conclusion

TI TPSM series power modules, through innovative packaging and topology technologies such as MagPack, HotRod, and ZEN 1, provide a modular approach to DC‑DC power design. The TPSM family not only offers a complete product matrix from low‑voltage to high‑voltage and from milliamps to several amps, but also significantly reduces power supply design costs through its pre‑validated integrated architecture.

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