As demand for AI computing power surges, TDK, the global leader in passive components, is accelerating its capacity layout. TDK executives recently revealed plans to invest approximately 40 billion yen (about US$260 million) over the next three years to expand thin-film inductor production lines at two plants in Yamanashi Prefecture and Yamagata Prefecture, Japan. Of this, the Yamanashi plant will receive 35 billion yen, focusing on thin-film inductors for AI chips. The Yamagata plant will receive 5 billion yen, targeting products supporting optical transceivers.
Thin-film inductors are core miniature components used to regulate and stabilize processor current. In AI servers, high-performance chips such as GPUs impose extremely stringent requirements on power supply ripple and transient response. With low DC resistance, high saturation current, and excellent high-frequency characteristics, thin-film inductors have become the preferred choice for high-end power modules. TDK's previously launched PLEC69B series thin-film inductors entered mass production in August 2025, specifically for the bias circuits of optical transceivers in AI data centers. Their DC resistance is approximately 70% lower than similar products, and their rated current is 1.7 times higher. According to TDK estimates, a single AI server requires thousands of MLCCs and inductors. As global data center construction accelerates, passive components are upgrading into strategic materials for computing infrastructure.
Downstream in the supply chain, CONEVO Electronics, as a professional integrated circuit component distributor, continues to provide industrial and communications customers with in-stock supply and BOM supporting services for MOSFETs, MCUs, power management ICs, and programmable logic devices. Through genuine product traceability and rapid delivery, CONEVO helps customers seize the AI hardware upgrade window. Today's hot-selling featured components:
Model | Mfr | Type | Key Features |
Vishay | P-Channel MOSFET | 60V/14.4A, 14.5mΩ low on-resistance, PowerPAK SO-8 package, suitable for high-side switching and power management | |
ST | 8-bit MCU | 128KB Flash/6KB RAM, 24MHz main frequency, LQFP-48, integrated CAN/SPI/I2C/UART, industrial-grade reliability | |
Lattice | Hardware Management Expander | 10 voltage + 2 current + 3 temperature monitoring, 4 MOSFET drivers, QFN-48, used for server power sequencing and thermal management | |
TI | Multiphase Power Controller | Dual-channel VR13 SVID compatible, D-CAP+ architecture, built-in NVM and PMBus, QFN-40, designed for server VCCIO/VMCP |
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