On September 16, Winbond Electronics announced that it has signed a definitive agreement with Infineon Technologies to acquire 100% equity interest in Infineon's NOR Flash and F-RAM businesses on an all-cash basis. The base transaction price is US$1.12 billion, and the closing is expected in the second half of 2027. After closing, the target company will revive the "Spansion" brand name, operate independently with its headquarters in San Jose, California, USA, and Winbond Electronics will directly or indirectly hold all of its equity.

Spansion was founded in 2003 through the combination of AMD's and Fujitsu's flash memory businesses, and long ranked among the leaders in the global NOR Flash market. In 2014, Cypress Semiconductor acquired it for approximately US$4 billion; in 2020, Infineon completed its acquisition of Cypress for EUR 10 billion, making Spansion part of Infineon's memory product line. Upon completion of the acquisition, Winbond stated that Spansion will maintain its existing operating model and operate independently.

Market share to rise above 30%

According to Omdia data, in 2025 Winbond Electronics ranked first in the global NOR Flash market with a 23% share, while Infineon ranked fourth with 11%. After the transaction is completed, Winbond's global market share will exceed 30%, further widening the gap with competitors.

In terms of product structure, Winbond's NOR Flash is mainly aimed at the consumer electronics market, with automotive revenue accounting for about 10% to 15%. Infineon's product line, by contrast, focuses on medium- and high-density capacities from 256Mb to 4Gb, concentrated in automotive-grade and high-end industrial applications. Through this acquisition, Winbond will not only gain a more complete product portfolio, but also directly obtain Infineon's automotive functional safety ASIL-D certification qualifications and Tier 1 supplier customer resources, which is expected to significantly shorten the product certification cycle in the European and American automotive markets.

Infineon's Strategic Choice

From Infineon's perspective, the sale of the NOR Flash and F-RAM businesses is a continuation of its strategy of focusing on core areas. Peter Schiefer, President of Infineon's Automotive Division, said the transaction enables the company to further focus on core growth drivers, optimize its product portfolio and capital allocation, and at the same time allow the NOR Flash business to fully realize its potential.

In recent years, Infineon has continued to adjust its manufacturing footprint, having sold a wafer fab in Texas and a backend manufacturing base in Bangkok. After this divestiture, resources will be more concentrated on power systems, automotive, and IoT areas. Infineon has not, however, completely exited the memory market, it will continue to provide niche solutions such as SRAM, HYPERRAM, nvSRAM, and radiation-hardened memory.

CONEVO — IC Component Supply Services

On the memory and logic device procurement side, CONEVO, as a professional integrated circuit component distributor, relies on a well-established global procurement network and a genuine IC traceability system to provide industrial and communications customers with in-stock supply and one-stop BOM supporting services. Today's hot-selling featured components are as follows:

● W25Q80DVSNIG (Winbond) — 8Mb Serial NOR Flash, SPI interface, 104MHz, SOIC-8 package, suitable for code storage and embedded system boot.

● W25Q80DVSSSG (Winbond) — 8Mb Serial NOR Flash, SPI interface, SOIC-8 package, supporting high-reliability data logging and firmware storage.

● W971GG6NB-25 (Winbond) — 1Gb DDR2 SDRAM, FBGA-84 package, 400MHz clock frequency, suitable for memory expansion in network equipment and embedded systems.

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