On September 18, 2026, the 7th Civil Chamber of the Munich Regional Court I issued a first-instance judgment in two patent infringement cases brought by YMTC against Micron, finding that Micron infringed two German utility model patents held by YMTC (DE202020006166U1 and DE202021004551U1), and issued an injunction ordering Micron to stop selling the relevant infringing products in Germany. This is YMTC's first substantive injunction victory worldwide since the two sides' patent war fully erupted in November 2023. Note that the injunction is limited to the products at issue and does not apply to all Micron products.

Micron said it disagrees with the ruling, will appeal, and will challenge the patents at issue through invalidity proceedings. It stressed that German utility models are not substantively examined. The company has accumulated more than 62,000 patents in the storage field and will continue to defend its rights. On the same day, the Munich court held hearings in three other related cases but made no substantive ruling; they have been postponed.

Parallel Proceedings in Multiple Jurisdictions

The patent confrontation between the two began in the United States. In November 2023, YMTC sued Micron in the Northern District of California, asserting infringement of 8 3D NAND patents; in July 2024, it added 11 more (covering NAND and DRAM); in October 2025, it again sued Micron and distributor Avnet in the Eastern District of Texas, adding 8 patents (covering 176–276-layer NAND and low-power DRAM). According to a July 2026 statement by YMTC, its U.S. infringement litigation involves 27 patents and 295 claims in total, all currently pending.

At the U.S. Patent Trial and Appeal Board (PTAB), Micron has filed invalidity requests against 19 YMTC patents, about 7 of which have been ruled invalid; in January 2026, the U.S. Patent and Trademark Office (USPTO) terminated YMTC's invalidation proceedings against two Micron patents for failing to adequately disclose real parties in interest. In China, YMTC filed invalidation requests in December 2025 against three Micron 3D storage patents; in June 2026, the China National Intellectual Property Administration (CNIPA) ruled two partially invalid and one fully invalid. In addition, YMTC has filed parallel lawsuits in the High Court of England and Wales and the Unified Patent Court.

CONEVO Component Assurance

As a professional global IC distributor, CONEVO provides shortage solutions and full BOM services, with rapid response and stable delivery as core capabilities, helping customers lock in key components and optimize supply chain flexibility during periods of price volatility and tight lead times. Recent hot-selling components:

● MTFC8GAMALNA-AAT (Micron) — 8GB eMMC 5.1 storage chip, 153-ball VFBGA package

● XC7A35T-2CSG324I (AMD/Xilinx) — Artix-7 FPGA, 33,280 logic cells, 400MHz maximum frequency, 324-CSBGA package

● MCP3208-CI/SL (Microchip) — 12-bit 8-channel successive approximation ADC, SPI interface, 100ksps sampling rate, 16-SOIC package

● TPS53513RVER (TI) — 4.5V to 18V input, 8A synchronous buck SWIFT™ converter, integrated 13.8mΩ and 5.9mΩ power MOSFETs, 28-VQFN package

Website: www.conevoelec.com

Email: info@conevoelec.com