NXP USA Inc. LPC2109FBD64/01,15

LPC2109FBD64/01,15


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC2109FBD64/01,15
  • Package: 64-LQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: LPC2109FBD64/01,15(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series LPC2100
Package Tray
Product Status Not For New Designs
Core Processor ARM7®
Core Size 16/32-Bit
Speed 60MHz
Connectivity CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals POR, PWM, WDT
Number of I/O 46
Program Memory Size 64KB (64K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 8K x 8
Voltage - Supply (Vcc/Vdd) 1.65V ~ 3.6V
Data Converters A/D 4x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 64-LQFP
Supplier Device Package 64-LQFP (10x10)
Base Product Number LPC2109
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 160
ARM7® LPC2100 Microcontroller IC 16/32-Bit 60MHz 64KB (64K x 8) FLASH 64-LQFP (10x10)
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