NXP USA Inc. MC33186DH1R2

MC33186DH1R2


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC33186DH1R2
  • Package: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC33186DH1R2(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Obsolete
Output Configuration Half Bridge (2)
Applications DC Motors, General Purpose, Solenoids
Interface Logic
Load Type Inductive
Technology Bi-CMOS
Rds On (Typ) 150mOhm
Current - Output / Channel 5A
Current - Peak Output -
Voltage - Supply 5V ~ 28V
Voltage - Load 5V ~ 28V
Operating Temperature -40°C ~ 150°C (TJ)
Features Status Flag
Fault Protection Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
Mounting Type Surface Mount
Package / Case 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Supplier Device Package 20-HSOP
Base Product Number MC33186
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 750
Half Bridge (2) Driver DC Motors, General Purpose, Solenoids Bi-CMOS 20-HSOP
Contact Information
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