| Parameters | |
|---|---|
| Series | Spartan®-3 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | RoHS non-compliant |
| Package / Case | 456-BBGA |
| Mfr | AMD |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Supplier Device Package | 456-FBGA (23x23) |
| Number of I/O | 333 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Number of Gates | 1000000 |
| Number of Logic Elements/Cells | 17280 |
| Number of LABs/CLBs | 1920 |
| Total RAM Bits | 442368 |
| Package | Bulk |
| Product Status | Active |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | XC3S1000 |
| REACH Status | REACH Unaffected |
| Standard Package | 60 |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
XC3S1000-4FG456C High-Performance FPGA by AMD Xilinx Spartan-3 Family
The XC3S1000-4FG456C is a mid-range field-programmable gate array (FPGA) from the AMD Xilinx Spartan-3 family, designed for cost-sensitive, high-volume applications such as industrial control, communication equipment, and consumer electronics. Built on a 90 nm CMOS process, this device delivers up to 1,000,000 system gates organized across 17,280 logic cells within 1,920 configurable logic blocks (CLBs). The "-4" speed grade guarantees a maximum operating frequency of up to 312 MHz, making it one of the fastest options in the Spartan-3 lineup. With a core voltage of 1.14 V to 1.26 V and a commercial temperature range of 0°C to +85°C, the chip balances low power consumption with robust performance for demanding digital logic designs.
The FPGA features 432 Kbit of block RAM (BRAM) and approximately 72 Kbit of distributed RAM, providing a total of roughly 442 Kbit of embedded memory for data buffering, FIFO storage, and on-chip caching. It integrates up to 24 dedicated 18x18-bit multipliers, enabling efficient implementation of DSP algorithms such as FIR filters, FFTs, and motor control computations. Clock management is handled by up to 4 global clock buffers and 24 Digital Clock Managers (DCMs), offering fine-grained control over phase, frequency, and duty cycle. The device exposes 333 user I/O pins through a 456-ball FineLine BGA (FBGA-456) package measuring 23 mm x 23 mm with 1 mm ball pitch, supporting a wide range of I/O standards including LVTTL, LVCMOS, SSTL, HSTL, and PCI. Configuration is supported via JTAG and SelectMAP interfaces, and the built-in ICAP (Internal Configuration Access Port) enables in-system reconfiguration for dynamic hardware updates.
Alternative FPGA Models
● EP4CE10F17C8N (Intel/Altera) — A low-cost Cyclone IV FPGA offering 10,080 logic elements and 475 Kbit of memory, suitable as a direct replacement for Spartan-3 designs targeting budget-conscious consumer and industrial applications.
● XC3S700A-4FGG484C (AMD Xilinx) — A smaller Spartan-3A variant with 7168 logic cells and 360 Kbit of BRAM in a 484-ball BGA, ideal for designs that need moderate logic capacity with a lower pin count and reduced cost.
● LFE5U-45F (Lattice Semiconductor) — A low-power 45K-LUT FPGA from Lattice with hardened DSP blocks and SERDES support, targeting applications that previously used Spartan-3 devices but require modern power efficiency and smaller form factors.