| Parameters | |
|---|---|
| Series | Spartan®-7 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | ROHS3 Compliant |
| Package / Case | 484-BGA |
| Mfr | AMD |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Supplier Device Package | 484-FPBGA (23x23) |
| Number of I/O | 338 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Number of Logic Elements/Cells | 102400 |
| Number of LABs/CLBs | 8000 |
| Total RAM Bits | 4423680 |
| Package | Tray |
| Product Status | Active |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | XC7S100 |
| Standard Package | 1 |
| ECCN | 5A002A1 |
| HTSUS | 8542.39.0001 |
XC7S100-1FGGA484C AMD Xilinx Spartan-7 FPGA
XC7S100-1FGGA484C belongs to AMD Xilinx Spartan-7 cost-optimized SRAM-based FPGA family built on 28nm high-performance low-power process, housed in 484-ball FGGA surface-mount package with ample PCB routing space, marked commercial grade for 0°C to +85°C operating junction temperature, core supply voltage fixed at 1.0V and flexible I/O bank voltage supporting 1.2V up to 3.3V multi-standard logic levels. This device carries 101,440 logic cells, 5,400Kbits block RAM, 160 DSP48E1 arithmetic slices for DSP acceleration, 240 differential I/O pairs and total 348 user single-ended I/Os, paired with six MMCM clock management tiles for high-precision frequency synthesis and skew elimination, fully RoHS compliant with MSL3 rating to fit automated volume SMT manufacturing for industrial and consumer reconfigurable hardware platforms.
XC7S100-1FGGA484C FPGA Features and Applications
This Spartan-7 FPGA integrates robust SelectIO interface banks supporting LVCMOS, LVDS, RSDS, and SSTL signaling with data rates reaching 1.2Gbps per differential pair, embedded JTAG IEEE 1149.1 boundary scan for in-circuit test and bitstream configuration, plus multiple loading modes including SPI Flash, BPI Flash and JTAG for flexible firmware deployment. It delivers ultra-static power consumption versus older Spartan-6 generations, supports soft processor cores like MicroBlaze for lightweight SoC construction, and features built-in security bitstream encryption to prevent design piracy. DSP slices deliver efficient multiply-accumulate operations for filtering, motor control and signal processing tasks, while abundant block RAM enables deep FIFO and frame buffer storage without external memory chips.
It acts as central reconfigurable logic controller widely adopted for industrial motion control boards, multi-channel data acquisition systems, high-speed camera interface converters, communication protocol gateways, medical test instrumentation, consumer display processing units and rugged embedded signal processing hardware, balancing affordable pricing, rich DSP and I/O resources to replace legacy ASICs and older FPGA generations in mid-complexity industrial and commercial electronic designs.
Alternative FPGAs
● XC7S100-1FGGA484I (Xilinx): Pin identical industrial temperature variant spanning -40°C to +100°C for harsh environment direct drop-in PCB substitution.
● LFE5U-12F-8BG384C (Lattice): Low-power flash-based FPGA with comparable logic capacity and instant power-up operation as cross-brand second-source alternative.
● 10M10DAF484C8G (Intel Cyclone 10): Cost-effective Intel FPGA with matching ball package footprint and compatible I/O standards for mass production design swap.