XCZU4EV-2SFVC784I

XCZU4EV-2SFVC784I


  • Manufacturer: AMD
  • CONEVO NO: XCZU4EV-2SFVC784I
  • Package: 784-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
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Parameters
Series Zynq® UltraScale+™ MPSoC EV
Moisture Sensitivity Level (MSL) 4 (72 Hours)
RoHS Status ROHS3 Compliant
Package / Case 784-BFBGA, FCBGA
Mfr AMD
Operating Temperature -40°C ~ 100°C (TJ)
Supplier Device Package 784-FCBGA (23x23)
Speed 533MHz, 600MHz, 1.3GHz
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Number of I/O 252
Architecture MCU, FPGA
Peripherals DMA, WDT
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Flash Size -
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package Tray
Product Status Active
Base Product Number XCZU4
REACH Status REACH Unaffected
Standard Package 1
ECCN 5A002A4 XIL
HTSUS 8542.39.0001

XCZU4EV-2SFVC784I AMD Xilinx Zynq UltraScale+ MPSoC FPGA 533MHz 600MHz 1.3GHz

The XCZU4EV-2SFVC784I is a high-performance, industrial-grade multiprocessor system-on-chip (MPSoC) from AMD Xilinx's Zynq UltraScale+ EV family, built on 16nm FinFET+ technology. It integrates a powerful processing system (PS) with a flexible programmable logic (PL) fabric, combining quad-core ARM Cortex-A53 (up to 1.5GHz), dual-core ARM Cortex-R5 real-time processors, ARM Mali-400 MP2 GPU, and dedicated H.264/H.265 video codec unit (VCU) into a single 784-FCBGA package. This heterogeneous SoC delivers exceptional computing power, real-time responsiveness, and hardware acceleration for embedded vision, industrial automation, and 5G communication applications, with an extended industrial temperature range (-40°C to 100°C) for reliable operation in harsh environments.

The XCZU4EV-2SFVC784I is ideal for applications requiring high-performance processing, real-time control, and advanced multimedia capabilities: 

● Embedded vision systems including industrial machine vision, surveillance cameras, and medical imaging devices, leveraging its VCU and GPU for real-time video analytics

● Industrial automation such as programmable logic controllers (PLCs), robotics, and motion control systems, utilizing the Cortex-R5 cores for deterministic real-time processing

●  5G wireless infrastructure including edge computing nodes, small cell base stations, and radio unit (RU) processing, benefiting from high-speed transceivers and flexible FPGA logic

● Automotive ADAS for advanced driver assistance systems, integrating multi-sensor data processing and video recognition

● Aerospace and defense for radar signal processing, satellite communication, and secure embedded systems, withstanding rugged environmental conditions

Alternative Embedded FPGA Models

● Intel Agilex 7 FPGA (AGF014R24A1E2E30): Intel’s alternative SoC FPGA with dual-core ARM Cortex-A53, high-speed transceivers, and industrial temperature support, ideal for communication and industrial applications.

● Microchip PolarFire SoC (MPF300T-FC1156): RISC-V-based SoC FPGA with dual-core RV64GC cores, low-power PolarFire FPGA fabric, and industrial-grade reliability for embedded and edge systems.

● NXP i.MX 8QuadMax (MCIMX8QM6AVUFF): Applications processor with quad-core Cortex-A53, dual-core Cortex-R5, and Vivante GPU, optimized for automotive and industrial multimedia applications.

● Texas Instruments TDA4VM (TDA4VM88T): Jacinto™ 7 automotive processor with dual-core Cortex-A72, DSP cores, and hardware vision accelerators, designed for ADAS and industrial vision systems.

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