EP3SL70F484I4N

EP3SL70F484I4N


  • Manufacturer: Intel
  • CONEVO NO: EP3SL70F484I4N
  • Package: 484-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
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Parameters
Voltage - Supply 0.86V ~ 1.15V
Number of Logic Elements/Cells 67500
Number of LABs/CLBs 2700
Total RAM Bits 2699264
Package Tray
Product Status Obsolete
Conevo-Key Programmable Not Verified
Base Product Number EP3SL70
Other Names 971141
Standard Package 60
ECCN 3A001A2C
HTSUS 8542.39.0001
Series Stratix® III L
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status RoHS Compliant
Package / Case 484-BBGA, FCBGA
Mfr Intel
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Supplier Device Package 484-FBGA (23x23)
Number of I/O 296

EP3SL70F484I4N Stratix III Low-Power FPGA IC 296 2699264 67500 484-BBGA, FCBGA

The EP3SL70F484I4N is a high-performance, low-power FPGA from Intel (formerly Altera), belonging to the Stratix III L series. Built on a 65nm CMOS process with a 0.9V core voltage, it features 67,500 logic elements (2,700 LABs), 3.75Mbits of embedded RAM, and 196 DSP blocks, delivering a maximum performance of 717MHz. Housed in a compact 484-pin FBGA package, it offers 296 user I/O pins with advanced dynamic on-chip termination and high-speed signaling capabilities. Engineered with Intel's Programmable Power Technology, it optimizes power consumption by dynamically disabling unused logic blocks, making it ideal for power-constrained, high-throughput applications. This industrial-grade device operates over the -40°C to +100°C temperature range, supports 256-bit AES configuration encryption for robust IP security, and integrates advanced error detection circuitry for mission-critical reliability.

EP3SL70F484I4N Key Features

● 67,500 logic elements

● 2,700 LABs

● 3.75Mbits embedded RAM

● 196 dedicated 18x18 DSP blocks

● 65nm process, 0.9V core

● 717MHz max performance

● 296 high-speed I/Os 

Alternative FPGA Models

1. Xilinx XC5VLX50T-1FF484C: Virtex-5 FPGA with 55k logic cells, 288 DSP slices, 484-pin FBGA, comparable high-performance for wired communications and signal processing.

2. Lattice LFE5UM-45F-484C6: ECP5 45K FPGA, 44k LUTs, 156 DSP blocks, low-power 484-pin package, cost-effective alternative for high-speed I/O and embedded vision.

3. Microchip PolarFire MPF300T-1FCF484I: 300K LE FPGA, 384 DSP modules, 484-pin FBGA, ultra-low power with RISC-V processor integration for secure industrial IoT designs.

4. Intel EP3SL50F484I4N: Lower-density Stratix III variant (50k LEs), pin-compatible 484-pin FBGA, ideal for cost-down designs with similar I/O and power features.

5. Xilinx XC6VLX75T-1FF484G: Virtex-6 75K FPGA, 484-pin package, advanced 40nm process, higher DSP bandwidth for high-performance computing and data centers.

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