W29N01HVSINA TR

W29N01HVSINA TR


  • Manufacturer: Winbond Electronics
  • CONEVO NO: W29N01HVSINA TR
  • Package: 48-TFSOP (0.724", 18.40mm Width)
  • Datasheet: PDF
  • Stock: In stock
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Details

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Parameters
Series -
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status ROHS3 Compliant
Package / Case 48-TFSOP (0.724", 18.40mm Width)
Mfr Winbond Electronics
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C (TA)
Technology FLASH - NAND (SLC)
Supplier Device Package 48-TSOP
Access Time 6 ns
Memory Size 16Mbit
Memory Type Non-Volatile
Voltage - Supply 1.65V ~ 1.95V
Clock Frequency 133 MHz
Memory Organization 2M x 8
Memory Format FLASH
Memory Interface SPI - Quad I/O, QPI, DTR
Write Cycle Time - Word, Page 3ms
Package Tape & Reel (TR)
Product Status Active
Base Product Number W29N01
REACH Status REACH Unaffected
Other Names 256-W29N01HVSINATR
Standard Package 1,500
ECCN 3A991B1A
HTSUS 8542.32.0071

W29N01HVSINA TR 1Gb SLC NAND Flash memory IC 133 MHz 6 ns 

The W29N01HVSINA TR is a high-reliability 1Gb (128MB) SLC NAND Flash memory IC from Winbond, housed in a compact 48-TSOP package. Operating from a 2.7V–3.6V supply, it features an x8 multiplexed interface with a fast access time of 25ns, ideal for space-constrained embedded systems requiring robust code storage and data logging. Organized as 1,024 erasable blocks (each 135,168 bytes) with 64 programmable pages per block, it delivers efficient wear leveling and error management. Rated for the industrial temperature range (-40°C to +85°C), it is designed for long-term operation in harsh environments, serving as a trusted solution for firmware storage, multimedia, and industrial data acquisition.

Selection Advantages

The W29N01HVSINA TR stands out with its 1Gb SLC NAND architecture, delivering superior speed and endurance compared to MLC/TLC alternatives, making it ideal for frequent write operations like firmware updates and data logging. Its 25ns access time and low power consumption optimize performance for time-critical embedded applications, while the compact 48-TSOP package reduces PCB footprint. With an industrial temperature range and robust design, it ensures reliable operation in extreme environments, and its standard interface enables easy drop-in replacement for legacy systems, minimizing design effort and redesign costs.

Alternative NAND Memory ic Models

1. Micron MT29F1G08ABAEAWP: 1Gb SLC NAND Flash, TSOP-48, 3.3V, 25ns access, cost-effective drop-in replacement for industrial and consumer applications.

2. GigaDevice GD5F1GQ5UEYIG: 1Gb SLC NAND, TSOP-48, 3.3V, high-reliability with advanced ECC, suitable for automotive and industrial grade designs.

3. Macronix MX30LF1G18AC-TI: 1Gb SLC NAND, TSOP-48, 3.3V, low-power variant with extended temperature range for battery-powered IoT devices.

4. Winbond W29N01HVBINF: 1Gb SLC NAND, TSOP-48, 3.3V, 4-bit ECC support, pin-compatible upgrade for enhanced error correction needs.

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