AP3N1R8MT-L

Introducing the AP3N1R8MT-L, the ultimate all-in-one solution to meet your technological needs. This state-of-the-art device is designed to revolutionize your productivity and immerse you in a world of seamless connectivity. With its sleek and modern design, the AP3N1R8MT-L is a perfect blend of style and functionality. Packed with advanced features, this device is a laptop, tablet, and smartphone all in one. Whether you're gaming, working, or staying connected with loved ones, this versatile device has got you covered. Powered by the latest Intel processor, the AP3N1R8MT-L delivers lightning-fast performance, ensuring smooth multitasking and effortless browsing. Its vibrant Full HD touchscreen display provides stunning visuals and an immersive viewing experience. Stay connected and productive wherever you go with the AP3N1R8MT-L's built-in 4G LTE connectivity and Wi-Fi support. Never worry about running out of storage space, as this device offers ample storage and expandability options. Experience the future of technology with the AP3N1R8MT-L. It's time to take your productivity and entertainment to new heights.

banner

Other Products

View More
  • 2368-69-53RGB-WRKIT-ND

    2368-69-53RGB-WRKIT-ND

  • 1303050020-ND

    1303050020-ND

  • 2368-69-36R-WR-KIT-ND

    2368-69-36R-WR-KIT-ND

  • 2368-69-36A-WR-KIT-ND

    2368-69-36A-WR-KIT-ND

  • 1647-1051-ND

    1647-1051-ND

  • 2368-69-36PU-KIT-ND

    2368-69-36PU-KIT-ND

  • 1303050210-ND

    1303050210-ND

  • 2368-69-56RGBWW-WRK-ND

    2368-69-56RGBWW-WRK-ND

  • 2368-69-53RGB-KIT-ND

    2368-69-53RGB-KIT-ND

  • 1647-1059-ND

    1647-1059-ND

  • 2368-69-36A-KIT-ND

    2368-69-36A-KIT-ND

  • 2608-BAE00ZM-ND

    2608-BAE00ZM-ND

Related Blogs

  • 2025 / 10 / 15

    OpenAI's Hardware Collaboration Strategy: Building a Robust Computing Power Ecosystem

    OpenAI has recently announced three major hardware collaborations with Broadcom, AMD, and NVIDIA, aiming to deploy a total of 26 gigawatts of computing power. ...

    OpenAI's Hardware Collaboration Strategy: Building a Robust Computing Power Ecosystem
  • 2025 / 10 / 14

    Popular IC Components in Recent Times: Performance and Alternatives

    Explores popular IC components known for their exceptional performance and broad applications, like ISO1050DUBR, ADR421ARMZ, XCZU47DR-2FFVE1156I, PCF8563TS/5,118, and STM32G030F6P6TR......

    Popular IC Components in Recent Times: Performance and Alternatives
  • 2025 / 10 / 13

    Wingtech's $14.7B yuan Semiconductor Assets Frozen by Netherlands: Full Story

    On October 12, 2025, Wingtech Technology announced that the Dutch government had frozen assets of its wholly-owned subsidiary Nexperia, valued at 14.7 billion yuan....

    Wingtech's $14.7B yuan Semiconductor Assets Frozen by Netherlands: Full Story
  • 2025 / 10 / 11

    What Is a Voltage-Level Translator?

    Voltage-level translators, also known as level shifters, are crucial for enabling communication between electronic devices operating at different voltage levels. They prevent signal distortion and equipment damage by converting signal voltages accurately. ...

    What Is a Voltage-Level Translator?
  • 2025 / 10 / 10

    NVIDIA Adds Orders for 800G Optical Modules: The Future of Data Centers

    NVIDIA has significantly increased its orders for 800G optical modules for 2026, with a 35% rise in demand. The growing need for high-speed optical modules in data centers, driven by AI, highlights the importance of 800G modules....

    NVIDIA Adds Orders for 800G Optical Modules: The Future of Data Centers
  • 2025 / 10 / 09

    Accelerating Innovation: Altera Expands Its Agilex™ FPGA Portfolio

    Altera is expanding its Agilex™ FPGA portfolio with new hardware and software solutions. The Agilex 5 and Agilex 3 SoC FPGAs are now in mass production, offering low latency and high integration for edge AI and co-processing applications. ...

    Accelerating Innovation: Altera Expands Its Agilex™ FPGA Portfolio
  • 2025 / 09 / 30

    STMicroelectronics' Tour PLP Pilot Line Targets Q3 2026 Kick-Off

    ST brings next-gen Panel-Level Packaging to Tours: $60M pilot line starts Q3-2026, boosting throughput and cutting cost....

    STMicroelectronics' Tour PLP Pilot Line Targets Q3 2026 Kick-Off
  • 2025 / 09 / 29

    ARM Tech's STAR-MC3: Powering Up MCU AI with Innovation

    ARM Technology has launched the third-generation high-energy-efficient embedded chip IP, "Stellar" STAR-MC3, significantly enhancing MCU AI processing capabilities. ...

    ARM Tech's STAR-MC3: Powering Up MCU AI with Innovation
  • 2025 / 09 / 28

    AMD's DDR5 Innovation: HB-DIMM for Next-Level Performance

    AMD's new patent for High Bandwidth Dual In-line Memory Module (HB-DIMM) represents a significant leap in DDR5 memory technology. ...

    AMD's DDR5 Innovation: HB-DIMM for Next-Level Performance
  • 2025 / 09 / 26

    Micron Samples the Industry's Fastest HBM4 Product: Tech Breakthrough and Market Outlook

    Micron Technology has made a significant breakthrough in the HBM field by shipping the industry's fastest 11 Gbps HBM4 samples....

    Micron Samples the Industry's Fastest HBM4 Product: Tech Breakthrough and Market Outlook
Contact Information
close