EPM7128EQC100-15

Introducing the EPM7128EQC100-15, a powerful programmable logic device for all your digital system design needs. This versatile product provides excellent performance and flexibility, making it an ideal choice for a wide range of applications. The EPM7128EQC100-15 features a high-density architecture with 128 macrocells and 256 input/output pins, allowing for the implementation of complex digital functions. With its advanced programmability, you can easily customize and optimize your designs to meet specific requirements. Equipped with 15 ns pin-to-pin delay, this device offers fast and efficient operation, ensuring high-speed performance in your digital systems. It also includes in-system programmability, allowing for easy updates and modifications without the need for physical device replacements. Furthermore, the EPM7128EQC100-15 is built to withstand challenging environments, with its industrial-grade temperature range and robust design. This makes it suitable for use in demanding applications such as automotive, aerospace, and industrial control systems. Whether you are designing communication systems, digital signal processing applications, or embedded control systems, the EPM7128EQC100-15 provides the power, flexibility, and reliability you need to bring your designs to life. Experience the exceptional performance of this programmable logic device and unlock new possibilities in digital system design.

banner

Other Products

View More
  • Renesas Electronics America Inc 90E21PYGI8

    Renesas Electronics America Inc 90E21PYGI8

  • Analog Devices Inc. ADE7978ACPZ

    Analog Devices Inc. ADE7978ACPZ

  • Microchip Technology MCP3914A1T-E/MVVAO

    Microchip Technology MCP3914A1T-E/MVVAO

  • Cirrus Logic Inc. CS5466-ISZR

    Cirrus Logic Inc. CS5466-ISZR

  • STMicroelectronics STPM11ATR

    STMicroelectronics STPM11ATR

  • Analog Devices Inc./Maxim Integrated MAX78615+PSU/A00

    Analog Devices Inc./Maxim Integrated MAX78615+PSU/A00

  • Analog Devices Inc./Maxim Integrated MAX78615+LMU/A01T

    Analog Devices Inc./Maxim Integrated MAX78615+LMU/A01T

  • Analog Devices Inc./Maxim Integrated 78M6618-M/F/P2

    Analog Devices Inc./Maxim Integrated 78M6618-M/F/P2

  • Microchip Technology MCP39ITR10T-E/SS

    Microchip Technology MCP39ITR10T-E/SS

  • Analog Devices Inc. ADE7566ASTZF8

    Analog Devices Inc. ADE7566ASTZF8

  • Analog Devices Inc./Maxim Integrated 71M6511-IGTR/F

    Analog Devices Inc./Maxim Integrated 71M6511-IGTR/F

  • Analog Devices Inc. ADSST-AVR-4055

    Analog Devices Inc. ADSST-AVR-4055

Related Blogs

  • 2025 / 10 / 24

    Applied Materials Announces 4% Global Layoffs, Affecting Over 1,400 Employees

    On October 23, 2025, US chip equipment maker Applied Materials announced a global layoff plan, cutting 4% of its workforce, affecting about 1,444 employees. ...

    Applied Materials Announces 4% Global Layoffs, Affecting Over 1,400 Employees
  • 2025 / 10 / 23

    18A Process Breakthrough: Intel to Manufacture Microsoft's AI Chip Maia 2

    Intel has secured a significant order from Microsoft to manufacture the next-generation AI accelerator, Maia 2, using its advanced 18A process. ...

    18A Process Breakthrough: Intel to Manufacture Microsoft's AI Chip Maia 2
  • 2025 / 10 / 22

    ADI Sells Penang Plant to ASE: A Win-Win Deal

    On October 21, 2025, ASE and ADI signed a binding MOU in Penang, Malaysia, for ASE to acquire ADI's Penang facility. Established in 1994, the facility spans over 680,000 sq ft....

    ADI Sells Penang Plant to ASE: A Win-Win Deal
  • 2025 / 10 / 21

    Yageo's JPY 109 Billion Acquisition of Shibaura Electronics

    ...

    Yageo's JPY 109 Billion Acquisition of Shibaura Electronics
  • 2025 / 10 / 20

    Microsoft Plans to Relocate Surface Production Lines from China

    Microsoft is reportedly planning to relocate its Surface production lines from China, with the entire process, including components and final assembly, expected to move by 2026. ...

    Microsoft Plans to Relocate Surface Production Lines from China
  • 2025 / 10 / 17

    Oracle Bet: 50,000 AMD Chips for AI Supercluster

    Oracle plans to deploy 50,000 AMD Instinct MI450 AI chips starting Q3 2026 to build a public AI supercluster. It also the key infrastructure support for Oracle's $300 billion collaboration with OpenAI....

    Oracle Bet: 50,000 AMD Chips for AI Supercluster
  • 2025 / 10 / 16

    Samsung's Memory Innovations: HBM4E and LPDDR6 Lead

    Samsung Electronics is making significant strides in memory technology. It aims to achieve over 3TB/s bandwidth with its seventh-generation HBM4E by 2027, a 2.5x improvement over current HBM3E......

    Samsung's Memory Innovations: HBM4E and LPDDR6 Lead
  • 2025 / 10 / 15

    OpenAI's Hardware Collaboration Strategy: Building a Robust Computing Power Ecosystem

    OpenAI has recently announced three major hardware collaborations with Broadcom, AMD, and NVIDIA, aiming to deploy a total of 26 gigawatts of computing power. ...

    OpenAI's Hardware Collaboration Strategy: Building a Robust Computing Power Ecosystem
  • 2025 / 10 / 14

    Popular IC Components in Recent Times: Performance and Alternatives

    Explores popular IC components known for their exceptional performance and broad applications, like ISO1050DUBR, ADR421ARMZ, XCZU47DR-2FFVE1156I, PCF8563TS/5,118, and STM32G030F6P6TR......

    Popular IC Components in Recent Times: Performance and Alternatives
  • 2025 / 10 / 13

    Wingtech's $14.7B yuan Semiconductor Assets Frozen by Netherlands: Full Story

    On October 12, 2025, Wingtech Technology announced that the Dutch government had frozen assets of its wholly-owned subsidiary Nexperia, valued at 14.7 billion yuan....

    Wingtech's $14.7B yuan Semiconductor Assets Frozen by Netherlands: Full Story
Contact Information
close