Onsemi Acquires SWIR Vision Systems, Expands Smart Sensing Reach

Onsemi Acquires SWIR Vision Systems, Expands Smart Sensing Reach

July 4, 2024 — Onsemi, a global leader in semiconductor supply, today announced the successful completion of its strategic acquisition of SWIR Vision Systems®, a leading supplier of Colloidal Quantum Dot (CQD®) Short-Wave Infrared (SWIR) technology, which significantly expands the detectable spectru...

Embedded ICs: Driving Forces Behind Smart Electronics

Embedded ICs: Driving Forces Behind Smart Electronics

In the digital age, embedded systems are ubiquitous, ranging from simple household appliances to complex industrial automation equipment, all relying on Embedded Integrated Circuits (Embedded ICs) to perform their core functions. This article delves into the world of Embedded ICs, providing a c...

A18 chip exceeds M4: A new journey in the AI mobile phone market

A18 chip exceeds M4: A new journey in the AI mobile phone market

IntroductionApple's upcoming iPhone 16 series, equipped with the A18 chip, heralds a major breakthrough in the field of AI. Taiwan media reports pointed out that Apple has begun to increase the order size of A18 processors, and the full series is expected to use TSMC's second-generation 3nm ...

Investing in the Future, Samsung and SK Hynix Seek Low-Interest Loans

Investing in the Future, Samsung and SK Hynix Seek Low-Interest Loans

On July 1st, according to a report by The Korea Economic Daily, South Korea's two major semiconductor giants, Samsung Electronics and SK Hynix, are considering applying for substantial low-interest loans from the Korea Development Bank (KDB) to support their business expansion and investment in ...

8-Inch SiC Wafers, A 2025 Mass Production Outlook

8-Inch SiC Wafers, A 2025 Mass Production Outlook

The rapid development of wide-bandgap semiconductor technology has made the progress of 8-inch SiC wafer production a focal point in the industry. Nexperia recently announced plans to invest $200 million in the research and development of next-generation wide-bandgap semiconductor products, inc...

AI Chip Capacity Boost: Exploring Panel-Level Packaging FO-PLP

AI Chip Capacity Boost: Exploring Panel-Level Packaging FO-PLP

In the realm of semiconductor packaging technology, a quiet revolution is unfolding. As demand for artificial intelligence (AI) chips surges, traditional packaging technologies are struggling to keep up. TSMC and Samsung Electronics, two titans of chip manufacturing, are exploring a new pa...

Micron Q3 Earnings: AI-Driven HBM Chip Growth and Challenges

Micron Q3 Earnings: AI-Driven HBM Chip Growth and Challenges

IntroductionAs a global leader in memory device supply, Micron Technology has demonstrated significant business growth in its Q3 earnings report, propelled by the wave of artificial intelligence (AI). However, despite exceeding expectations in performance, the company still faces challenges in ...

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