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Three core components of power electronics: MOSFET, BJT, and IGBT
In modern power electronic systems, MOSFETs, BJTs, and IGBTs constitute the three pillars of power semiconductor devices. Their unique structures and operating principles determine their respective advantages and limitations in different application scenarios, collectively driving the advancement of...Read more -
Middle East Conflict Triggers Risk of Surging Chip Material Costs
In March 2026, as the Middle East war entered its third week, the global semiconductor industry is facing a potential supply chain crisis. SEMI Taiwan issued a statement on March 18, noting that Taiwanese semiconductor companies currently face no immediate risk of disruption to basic chemicals or ra...Read more -
Break the Ice! NVIDIA Resumes H200 Production for China
At the annual GTC held in San Jose, California on March 17, 2026, Nvidia CEO Jensen Huang announced that the company has received purchase orders from Chinese customers and is "restarting production" of the H200 AI accelerator specifically for the China market. Huang confirmed to CNBC that...Read more -
Sony CIS Yield Crisis: Supply Chain Concerns for Apple
Sony Semiconductor Solutions is facing a severe test of its flagship product line. The latest generation of CMOS image sensors (CIS) produced at the Nagasaki Technology Center (Nagasaki TEC) in Japan is encountering yield ramp-up challenges. This manufacturing facility accounts for over 80% of ...Read more -
Comprehensive Analysis of Popular IC Components and In-Stock Chip Solutions
As the global semiconductor supply chain landscape continues to evolve, spot inventory has become a critical cornerstone supporting production for terminal manufacturing enterprises. As a well-known electronic component service provider in the industry, CONEVO has leveraged its powerful supply ...Read more -
Rohm and Toshiba in Talks to Integrate Power Semiconductor Businesses
In March 2026, Japanese semiconductor manufacturers Rohm and Toshiba officially entered negotiations to integrate their power semiconductor businesses. According to informed sources, the two companies are exploring multiple integration frameworks, including the establishment of a joint venture ...Read more -
Price Surge: NXP Announces Price Adjustments Effective April 1
On March 5, 2026, NXP Semiconductors, a global leader in automotive semiconductors, issued an internal price adjustment notification to its partners, announcing price increases for selected products effective April 1, 2026. This price adjustment was not released through official public channels such...Read more -
Samsung Electronics Strike Crisis: Global Chip Supply Chain Faces New Challenge
On March 9, 2026, Samsung Electronics, the global semiconductor giant, faces a new labor crisis. The "Joint Struggle Headquarters," comprising three major unions representing approximately 89,000 employees, officially launched a strike authorization vote. This voting process, lasting until...Read more -
TI Launches Second Comprehensive Price Increase
Texas Instruments (TI), the global leader in analog chips, has announced that it will launch its second comprehensive price increase action on April 1, 2026. The price adjustment is expected to range between 15% and 85%, potentially covering all customer segments and involving multiple core product ...Read more -
Merger: DENSO Plans ¥1.3 Trillion Acquisition of ROHM
In March 2026, Japanese automotive components supplier DENSO formally submitted a full acquisition proposal to semiconductor manufacturer ROHM, with the transaction valued at approximately ¥1.3 trillion (around $8.2 billion). Should the deal materialize, the two companies would form a domestic Japan...Read more
