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Twin Troubles: Nokia and Ericsson Announce Global Layoffs
Early 2026 brought fresh turbulence to the global telecommunications equipment sector. Finland's Nokia and Sweden's Ericsson—the two European telecom equipment giants—have successively announced large-scale workforce reduction plans affecting nearly ten thousand employees combined.In March 2...Read more -
Kioxia to Discontinue Entire Traditional MLC/2D NAND Portfolio
On March 31, 2026, Kioxia issued its latest End-of-Life (EOL) notification to customers, announcing its gradual withdrawal from the traditional Floating Gate 2D NAND flash memory market. This marks the second discontinuation announcement from Kioxia within two weeks, following its mid-March not...Read more -
Omron Divests Core Electronic Components Business
On March 30, 2026, OMRON Corporation, the Japanese industrial automation giant, officially announced the sale of its core electronic components business—the Device & Module Solutions (DMB) division—to Carlyle, a leading U.S.-based alternative asset management firm. The transaction is valued at a...Read more -
Apple to Integrate YMTC NAND Flash, Exclusively for China Market
Faced with continuously rising storage chip prices, Apple Inc. is undertaking a critical supply chain adjustment. According to supply chain sources, Apple plans to establish a partnership with Chinese domestic semiconductor company Yangtze Memory Technologies Co. (YMTC), integrating its NAND flash m...Read more -
Micron Considers Acquisition of JDI's Mobara Plant
Japan Display Inc. (JDI) is engaged in advanced negotiations with Micron Technology, the U.S.-based memory chip giant, regarding the sale of its large-scale liquid crystal display panel production facility located in Mobara, Chiba Prefecture, Japan. According to reports, Micron intends to convert th...Read more -
Tower Semiconductor Strategically Restructures Japan Operations
Analog semiconductor foundry Tower Semiconductor officially announced a strategic restructuring of its Japan operations on March 25, 2026. The restructuring involves two key wafer fabrication facilities currently operated by TPSCo (Tower Partners Semiconductor Co.) — the 300mm Fab 7 located in ...Read more -
Mastering the AMD/Xilinx Product Spectrum: CPLD/FPGA Comprehensive Guide
In 1985, Ross Freeman founded Xilinx and introduced the world's first FPGA chip, the XC2064, pioneering a new era of programmable logic devices. After nearly four decades of development, Xilinx has become a leader in the FPGA field. Following its integration into AMD in 2022, its product portfol...Read more -
FCC Imposes Comprehensive Ban on Foreign-Manufactured Routers
On March 23, 2026, the U.S. Federal Communications Commission (FCC) formally issued a ban adding "all foreign-manufactured consumer-grade routers" to its Covered List, prohibiting the import of new models lacking authorization. The ban stems from an interagency national security assessment...Read more -
Qorvo RF Enterprise: Analysis of Its Popular GaN Amplifier Products
Qorvo stands as a global leader in connectivity and power solutions, formed in 2015 through the merger of RF Micro Devices (RFMD) and TriQuint Semiconductor. This strategic consolidation was designed to address increasingly complex RF solution requirements, establishing Qorvo's leadership positi...Read more -
Three core components of power electronics: MOSFET, BJT, and IGBT
In modern power electronic systems, MOSFETs, BJTs, and IGBTs constitute the three pillars of power semiconductor devices. Their unique structures and operating principles determine their respective advantages and limitations in different application scenarios, collectively driving the advancement of...Read more
