Breakthrough in mass production of Mini/Micro LED chips: The key role of mass transfer devices

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In the field of display technology, Mini LED and Micro LED technologies are gradually establishing their dominant position in specific application scenarios. Still, both technologies face challenges in achieving mass production. This article will explore how the solid chip can help solve the bottleneck problem of Mini/Micro LED chip mass production.

 

Application and development of Mini/Micro LED technology

Mini LED and Micro LED technologies each show unique advantages in different fields such as mobile phones, smart watches, and splicing displays. Micro leds are favored for their high performance in in-vehicle, transparent displays and oversized splicing displays, while their application in the AR market is also increasing. However, despite the vast market prospects, the mass production of Micro LED chips is still an urgent problem to be solved.

 

Mass production challenges and the role of solid crystal machines

The production of Mini/Micro LED display requires a large number of Mini/Micro LED chips. For example, the iPad Pro's 12.9-inch Mini LED backlight uses more than 10,000 Mini LED chips. As the key equipment of back-channel sealing of chip, the improvement of production efficiency is very important to solve the problem of mass production.

 

Bottlenecks faced by solid crystal machines

The Mini/Micro LED chip transfer process faces many challenges, including material, process, MURA effect, equipment continuity and other issues. These problems lead to a series of problems such as low transfer efficiency, difficult repair and high cost.

 

The development of mass transfer technology

In order to meet these challenges, the production efficiency, product yield and accuracy of cemented machines need to be significantly improved. Massive transfer technology has become the key to the industrialization of Mini/Micro LED chips. The Mini LED mass transfer full line device launched by ETan Semiconductor achieves high production speed and accuracy by using a chip array transfer device, and significantly improves yield.

 

Industry progress and cooperation

Products such as Etmade Automatic Equipment Micro LED mass transfer welding equipment and PRX's XBonder Pro demonstrate the industry's internal efforts to increase the mass production capacity of Mini/Micro LED chips. Inuo Laser is also laying out a large-scale transfer process demonstration line, indicating the further development of future technology.

 

Summary

With the joint efforts of upstream and downstream enterprises in the industrial chain, especially the investment of equipment manufacturers in the research and development of huge transfer equipment, the mass production capacity of Mini/Micro LED chips is expected to achieve a qualitative leap. This will not only drive the development of display technology, but also bring a richer and high-quality visual experience to consumers.

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