With the rapid development of on-device artificial intelligence (On-Device AI) technology, the demand for high-speed data processing in smartphones is continuously increasing. However, this also leads to the generation of a large amount of heat during device operation, which affects the overall performance of the phone. To address this challenge, SK Hynix announced on August 25, 2025, that it has successfully developed and begun supplying the world's first high-efficiency heat-dissipating mobile DRAM product using "High-K EMC" material.

Technological Innovation and Product Advantages

Traditional EMC (epoxy molding compound) is a key material used in the semiconductor post-process to seal and protect chips and to provide heat dissipation. SK Hynix has developed a new High-K EMC material by adding alumina to the traditional silica-based EMC. This innovation increases the thermal conductivity of the new material to 3.5 times that of traditional materials, thereby reducing the thermal resistance in the vertical heat conduction path by 47%.

The significant improvement in heat dissipation brings multiple benefits to smartphones. First, it helps improve the overall performance of smartphones under high-load operation, avoiding performance degradation caused by overheating and providing users with a smoother experience. Second, by reducing power consumption, the product can also extend battery life and increase product longevity. Additionally, the product has received high recognition from global customers and is expected to attract widespread attention and strong demand in the mobile device industry.

Industry Impact and Market Outlook

Currently, most flagship phones use the PoP (Package on Package) structure, which stacks DRAM vertically on top of the mobile processor. Although this structure can efficiently utilize limited space and increase data processing speed, it also causes heat generated by the mobile processor to accumulate inside the DRAM, affecting the overall performance of the device. SK Hynix's new DRAM product effectively solves this heat dissipation problem, providing an innovative solution for the heat dissipation issues of high-performance flagship models.

Lee Gyu-je, vice president in charge of SK Hynix's PKG product development, said that this product not only improves performance but also effectively alleviates the troubles of high-performance smartphone users, which is of great significance. The company will continue to consolidate its technological leadership in the next-generation mobile DRAM market based on material technology innovation. With the launch of this product, SK Hynix is expected to further increase its market share in the fierce market competition and drive the entire mobile device industry towards higher performance and more efficient heat dissipation.

Conclusion

The high-efficiency heat-dissipating mobile DRAM product launched by SK Hynix, which uses High-K EMC material, provides an effective solution to the heat dissipation challenges faced by current high-performance mobile devices with its excellent heat dissipation performance and significant improvement in the overall performance of smartphones. This innovation not only demonstrates SK Hynix's technical strength in the field of semiconductor packaging materials but also shows its keen market insight and continuous innovation capabilities. With the widespread application of this product, it is expected to have a profound impact on the mobile device industry, promoting technological progress and product upgrades.

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