On August 4, 2026, SK Hynix and SanDisk jointly released the first industry standard specification for the next-generation storage technology - High Bandwidth Flash (HBF). This specification was officially made public by the world's largest open data center technology cooperation organization, OCP, and is positioned as a universal open standard for the entire industry.

HBF is a new type of storage tier that lies between HBM and SSD. It not only possesses similar high-speed data transmission capabilities to HBM, but also can achieve significant capacity expansion based on NAND flash memory technology. In the context of the rapid popularization of AI inference and the surging demand for massive data processing, HBF, with its advantages of "high bandwidth and large capacity", has become a key technical path to break through the memory bottleneck in the AI era.

HBF Standard Core

The standard specifications released this time are the result of collaborative efforts over approximately six months by SK Hynix and SanDisk since they initiated standardized cooperation in August 2025 and established the HBF alliance in February 2026. The specifications have achieved three core core designs at the technical level:

Firstly, two NAND chip stacking schemes of 8 layers and 16 layers are introduced for capacity configuration, with a single package supporting a maximum of 512GB, effectively compensating for the capacity limitations of traditional HBM;

Secondly, the bandwidth is set according to three grades: Grade 1 to Grade 3, with data transmission capabilities ranging from approximately 0.4TB/s to 3.0TB/s, which can flexibly adapt to various AI scenarios from lightweight inference to large-scale computing clusters;

Thirdly, HBF adopts industry-standard UCIe interconnection interface between HBF and processors, laying the foundation for flexible adaptation with heterogeneous computing units such as GPUs and CPUs.

In addition, the standard comprehensively covers key contents such as electrical characteristics of interconnection interfaces, reliability of Die stacking processes and packaging guidelines, and software I/O interfaces, forming a complete link technical specification system that can be directly implemented.

Open Ecosystem

This specification was officially released through OCP and is clearly defined as an industry-wide open standard rather than an enterprise-private technology. The aim is to break down technical barriers and accelerate large-scale commercialization. Currently, the HBF alliance has gathered important industry participants such as Google and Tenstorrent, and the ecological map is continuously expanding.

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