-
2025 / 09 / 26
Micron Samples the Industry's Fastest HBM4 Product: Tech Breakthrough and Market Outlook
Micron Technology has made a significant breakthrough in the HBM field by shipping the industry's fastest 11 Gbps HBM4 samples....
-
2025 / 09 / 25
Onsemi Acquires Aura Semiconductor's Vcore Power Technology and IP
...
-
2025 / 09 / 22
Infineon Sells Its Thailand Backend Manufacturing Plant to MPI
Infineon Technologies AG has reached a final agreement with Malaysian Pacific Industries Berhad (MPI) to sell its backend manufacturing plant in Bangkok/Nonthaburi, Thailand. ...
-
2025 / 09 / 19
Cooperate! NVIDIA Invests $5 Billion in Intel
NVIDIA and Intel have announced a $5 billion investment deal to collaborate on AI infrastructure and personal computing products. Intel will design customized x86 CPUs for NVIDIA's AI platforms and integrate NVIDIA's RTX GPUs into Intel's SoCs......
-
2025 / 09 / 18
AI Chip Startup Groq Raises $750 Million in Funding
AI chip startup Groq has raised $750 million in a new funding round, bringing its valuation to $6.9 billion. Led by Disruptive and joined by major investors, this round highlights Groq's potential to disrupt the AI chip market. ...
-
2025 / 09 / 17
Western Digital Implements Price Hikes and Extends Lead Times
Western Digital has raised prices for its entire HDD product line and extended lead times by up to 10 weeks due to unprecedented demand and supply constraints. ...
-
2025 / 09 / 16
Vishay 1962→2025: Acquisitions, Innovations and Components
Vishay Intertechnology is a global leader in electronic components. Founded in 1962, it offers a wide range of products from discrete semiconductors to passive components....
-
2025 / 09 / 15
xAI Lays Off 500 Data Annotation Team Members
On September 12, 2025, Elon Musk's AI startup xAI announced via email that it would lay off about 500 employees from its data annotation team, which accounted for one-third of the team. ...
-
2025 / 09 / 12
Sony's New Generation of Image Sensors for Smartphones
Sony Semiconductor Solutions plans to supply next-generation image sensors to smartphones by March 2030. These new CMOS sensors will feature a 3-layer structure and 22nm-28nm process technology......
-
2025 / 09 / 11
From Car Audio to FPGA: Top 5 Popular IC Models
Top 5 hot ICs: car amp, high-efficiency PMIC, FPGA, 32 Mb SPI flash and 2.5 kV isolator—tiny chips powering tomorrow’s smart, green and safe electronics....