5CEFA9F27I7N

5CEFA9F27I7N


  • Manufacturer: Intel
  • CONEVO NO: 5CEFA9F27I7N
  • Package: 672-BGA
  • Datasheet: PDF
  • Stock: In stock
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Details

Tags

Parameters
Series Cyclone® V E
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status RoHS Compliant
Package / Case 672-BGA
Mfr Intel
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Supplier Device Package 672-FBGA (27x27)
Number of I/O 336
Voltage - Supply 1.07V ~ 1.13V
Number of Logic Elements/Cells 301000
Number of LABs/CLBs 113560
Total RAM Bits 14251008
Package Tray
Product Status Active
Conevo-Key Programmable Not Verified
Base Product Number 5CEFA9
REACH Status REACH Unaffected
Standard Package 40
ECCN 3A991D
HTSUS 8542.39.0001

5CEFA9F27I7N Intel Cyclone V E Industrial FPGA IC 336 14251008 301000 672-BGA

5CEFA9F27I7N belongs to Intel Cyclone V E cost-effective mid-range FPGA family fabricated on advanced 28nm low-power process, housed inside 672-ball FBGA SMD package with industrial temperature specification from -40°C to +100°C junction temperature, featuring total 301000 logic elements, 14.25Mbit embedded block RAM, 342 dedicated DSP slices and 336 configurable user I/O pins while running core supply voltage between 1.07V and 1.13V, fully compliant with RoHS & REACH standards and rated MSL3 moisture sensitivity level for stable automated SMT production mounting.

Features and Applications

This programmable chip integrates eight PLL clock modules and 16 global clock trees to support high-frequency system timing optimization, compatible with multi-standard single-ended and differential I/O including LVCMOS, LVDS and LVPECL alongside flexible multi-voltage I/O rails covering 1.2V up to 3.3V, natively supports DDR2/DDR3/LPDDR2 external memory controllers and two embedded EMAC blocks for wired Ethernet connection, adopts optimized low-leakage silicon design to cut static power consumption and enables full in-system JTAG reprogramming for iterative firmware upgrade without hardware replacement.

It serves as core programmable logic component widely deployed in industrial servo control units, multi-channel data acquisition modules, compact embedded vision preprocessing hardware, portable medical testing equipment and low-speed software-defined radio front-end boards, balancing abundant logic resource, moderate power draw and competitive unit cost for medium-volume industrial embedded product development and prototype verification.

Alternative field programmable gate array ics

● 5CEFA9F31I7N (Intel): Same Cyclone V E die specification with upgraded 896-FBGA package and expanded 480 I/O resources for projects needing extra peripheral expansion without core logic redesign.

● XC7A100T-1CSG324I (AMD Xilinx): Artix-7 industrial FPGA with comparable logic scale and DSP count as cross-brand alternative during original part supply shortage for industrial control PCB replacement.

● PF100QK200I (Gowin): Domestic mid-density FPGA with matching industrial temperature range and compatible memory interface to realize low-cost second-source substitution for cost-sensitive mass production.

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