Infineon Technologies CYW15G0403DXB-BGI

CYW15G0403DXB-BGI


  • Manufacturer: Infineon Technologies
  • CONEVO NO: CYW15G0403DXB-BGI
  • Package: 256-BGA Exposed Pad
  • Datasheet: -
  • Stock: In stock
  • Description: CYW15G0403DXB-BGI(Kg)

Details

Tags

Parameters
Mfr Infineon Technologies
Series HOTlink II™
Package Tray
Product Status Obsolete
Function -
Interface -
Number of Circuits 4
Voltage - Supply 3.135V ~ 3.465V
Current - Supply -
Operating Temperature -
Mounting Type Surface Mount
Package / Case 256-BGA Exposed Pad
Supplier Device Package 256-L2BGA (27x27)
Base Product Number CYW15G0403
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A991B1
HTSUS 8542.39.0001
Standard Package 40
Telecom IC 256-L2BGA (27x27)
Contact Information
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