NXP USA Inc. LPC1346FHN33,551

LPC1346FHN33,551


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC1346FHN33,551
  • Package: 32-VQFN Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: LPC1346FHN33,551(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series LPC13xx
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M3
Core Size 32-Bit Single-Core
Speed 72MHz
Connectivity I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals Brown-out Detect/Reset, POR, WDT
Number of I/O 26
Program Memory Size 48KB (48K x 8)
Program Memory Type FLASH
EEPROM Size 4K x 8
RAM Size 10K x 8
Voltage - Supply (Vcc/Vdd) 2V ~ 3.6V
Data Converters A/D 8x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 32-VQFN Exposed Pad
Supplier Device Package 32-HVQFN (7x7)
Base Product Number LPC1346
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 260
ARM® Cortex®-M3 LPC13xx Microcontroller IC 32-Bit Single-Core 72MHz 48KB (48K x 8) FLASH 32-HVQFN (7x7)
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