NXP USA Inc. LPC2364FBD100,551
| Parameters | |
|---|---|
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 100-LQFP |
| Supplier Device Package | 100-LQFP (14x14) |
| Base Product Number | LPC2364 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | 3A991A2 |
| HTSUS | 8542.31.0001 |
| Standard Package | 90 |
| Mfr | NXP USA Inc. |
| Series | LPC2300 |
| Package | Tray |
| Product Status | Discontinued at Digi-Key |
| Core Processor | ARM7® |
| Core Size | 16/32-Bit |
| Speed | 72MHz |
| Connectivity | CANbus, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT |
| Number of I/O | 70 |
| Program Memory Size | 128KB (128K x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | - |
| RAM Size | 34K x 8 |
| Voltage - Supply (Vcc/Vdd) | 3V ~ 3.6V |
| Data Converters | A/D 6x10b; D/A 1x10b |
| Oscillator Type | Internal |
ARM7® LPC2300 Microcontroller IC 16/32-Bit 72MHz 128KB (128K x 8) FLASH 100-LQFP (14x14)
