NXP USA Inc. LPC2470FET208,551

LPC2470FET208,551


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC2470FET208,551
  • Package: 208-TFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: LPC2470FET208,551(Kg)

Details

Tags

Parameters
Core Size 16/32-Bit
Speed 72MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number of I/O 160
Program Memory Size -
Program Memory Type ROMless
EEPROM Size -
RAM Size 98K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V
Data Converters A/D 8x10b; D/A 1x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 208-TFBGA
Supplier Device Package 208-TFBGA (15x15)
Base Product Number LPC2470
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 2 (1 Year)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 126
Mfr NXP USA Inc.
Series LPC2400
Package Tray
Product Status Not For New Designs
Core Processor ARM7®
ARM7® LPC2400 Microcontroller IC 16/32-Bit 72MHz ROMless 208-TFBGA (15x15)
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