NXP USA Inc. LPC3143FET180,551

LPC3143FET180,551


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC3143FET180,551
  • Package: 180-TFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: LPC3143FET180,551(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series LPC3100
Package Tray
Product Status Last Time Buy
Core Processor ARM926EJ-S
Core Size 16/32-Bit
Speed 270MHz
Connectivity EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals DMA, I²S, LCD, PWM, WDT
Number of I/O 20
Program Memory Size -
Program Memory Type ROMless
EEPROM Size -
RAM Size 192K x 8
Voltage - Supply (Vcc/Vdd) 1.1V ~ 3.6V
Data Converters A/D 4x10b
Oscillator Type External
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 180-TFBGA
Supplier Device Package 180-TFBGA (12x12)
Base Product Number LPC3143
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 189
ARM926EJ-S LPC3100 Microcontroller IC 16/32-Bit 270MHz ROMless 180-TFBGA (12x12)
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