NXP USA Inc. MC9S08QG4CPBE

MC9S08QG4CPBE


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC9S08QG4CPBE
  • Package: 16-DIP (0.300", 7.62mm)
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC9S08QG4CPBE(Kg)

Details

Tags

Parameters
RAM Size 256 x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Data Converters A/D 8x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Through Hole
Package / Case 16-DIP (0.300", 7.62mm)
Supplier Device Package 16-PDIP
Base Product Number MC9S08
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 25
Mfr NXP USA Inc.
Series S08
Package Tube
Product Status Obsolete
Core Processor S08
Core Size 8-Bit
Speed 20MHz
Connectivity I²C, SCI, SPI
Peripherals LVD, POR, PWM, WDT
Number of I/O 12
Program Memory Size 4KB (4K x 8)
Program Memory Type FLASH
EEPROM Size -
S08 S08 Microcontroller IC 8-Bit 20MHz 4KB (4K x 8) FLASH 16-PDIP
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