NXP USA Inc. MPC5554MZP80

MPC5554MZP80


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MPC5554MZP80
  • Package: 416-BBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MPC5554MZP80(Kg)

Details

Tags

Parameters
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 416-BBGA
Supplier Device Package 416-PBGA (27x27)
Base Product Number MPC5554
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935322744557
Standard Package 200
Mfr NXP USA Inc.
Series MPC55xx Qorivva
Package Tray
Product Status Not For New Designs
Core Processor e200z6
Core Size 32-Bit Single-Core
Speed 82MHz
Connectivity CANbus, EBI/EMI, SCI, SPI
Peripherals DMA, POR, PWM, WDT
Number of I/O 256
Program Memory Size 2MB (2M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 64K x 8
Voltage - Supply (Vcc/Vdd) 1.35V ~ 1.65V
Data Converters A/D 40x12b
Oscillator Type External
e200z6 MPC55xx Qorivva Microcontroller IC 32-Bit Single-Core 82MHz 2MB (2M x 8) FLASH 416-PBGA (27x27)
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