XC3S1000-4FG320C
| Parameters | |
|---|---|
| Series | Spartan®-3 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | RoHS non-compliant |
| Package / Case | 320-BGA |
| Mfr | AMD |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Supplier Device Package | 320-FBGA (19x19) |
| Number of I/O | 221 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Number of Gates | 1000000 |
| Number of Logic Elements/Cells | 17280 |
| Number of LABs/CLBs | 1920 |
| Total RAM Bits | 442368 |
| Package | Bulk |
| Product Status | Active |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | XC3S1000 |
| REACH Status | REACH Unaffected |
| Standard Package | 84 |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
XC3S1000-4FG320C Spartan-3 FPGA
The XC3S1000-4FG320C, manufactured by Xilinx, is a high-performance member of the Spartan-3 Field Programmable Gate Array family, built on an advanced 90nm process technology to deliver exceptional logic density and cost-effectiveness for complex digital designs. It features approximately one million system gates, comprising 1,728 configurable logic slices that translate to 15,360 logic cells, providing substantial computational resources for demanding state machines and arithmetic logic. Additionally, it incorporates 24 dedicated 18x18 hardware multipliers, making it highly capable of handling digital signal processing (DSP) tasks such as finite impulse response filters and fast Fourier transforms without consuming the general-purpose logic fabric.
Clock management is comprehensively optimized through four integrated Digital Clock Managers (DCMs), which provide flexible frequency synthesis, precise phase shifting, and zero-delay clock deskew to maintain synchronous system integrity across multiple clock domains. Housed in a 320-pin Fine-Pitch Ball Grid Array (FG320) package, the chip offers an impressive 221 maximum user I/O pins, supporting a wide variety of single-ended and differential I/O standards including LVDS, SSTL, and HSTL. This extensive I/O capability, combined with the robust BGA packaging featuring a 1.0mm pitch, ensures excellent signal integrity and thermal dissipation, making it highly suitable for high-density, space-constrained printed circuit board layouts.
Alternative FPGAs
● EP3C16F256C8N: An Intel Cyclone III FPGA offering 15,408 logic elements and 504 Kbits of embedded memory, providing comparable logic density and enhanced DSP capabilities for mid-range applications.
● LFXP2-17E-5FT256C: A Lattice XP2 FPGA featuring 17,000 LUTs and embedded block RAM with instant-on non-volatile flash configuration, serving as a robust alternative for reliable system boot-up.
● A3P1000-PQ208: A Microchip ProASIC3 flash-based FPGA delivering one million system gates with live-at-power-up operation, eliminating external configuration memory and enhancing system security.
● ECP3-17E-5FT256C: A Lattice ECP3 FPGA providing 17,000 LUTs with integrated SerDes and high-speed DDR3 support, ideal for data-intensive designs requiring advanced interfacing beyond the Spartan-3.
