XC3S1000-5FT256C
| Parameters | |
|---|---|
| Series | Spartan®-3 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | RoHS non-compliant |
| Package / Case | 256-LBGA |
| Mfr | AMD |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Supplier Device Package | 256-FTBGA (17x17) |
| Number of I/O | 173 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Number of Gates | 1000000 |
| Number of Logic Elements/Cells | 17280 |
| Number of LABs/CLBs | 1920 |
| Total RAM Bits | 442368 |
| Package | Tray |
| Product Status | Active |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | XC3S1000 |
| REACH Status | REACH Unaffected |
| Standard Package | 90 |
| ECCN | EAR99 |
| HTSUS | 8542.39.0001 |
XC3S1000-5FT256C AMD Spartan-3 SRAM FPGA IC 173 442368 17280
XC3S1000-5FT256C is a mid-density SRAM-based FPGA from Xilinx's classic Spartan-3 family built on 90nm process technology, housed in a 256-ball FT FBGA surface-mount package with tray delivery, RoHS compliant and MSL3 rated for automated SMT assembly, designated commercial grade for 0°C to +85°C junction temperature operation with a -5 speed grade for moderate timing performance. This device integrates 1,000,000 system gates equivalent capacity, 19,200 logic cells, 432Kbit block RAM storage, 24 dedicated 18×18 multiplier blocks for DSP acceleration, 8 clock management DLL modules, and 173 usable single-ended I/Os alongside differential signaling pairs, operating on a 1.2V core voltage with flexible 1.2V to 3.3V I/O bank supplies to match legacy and standard digital logic voltage levels.
It functions as the core reconfigurable controller for legacy industrial motion drive boards, older communication protocol converters, vintage test and measurement instrumentation, low-resolution video processing units, factory automation I/O expansion modules, and rugged portable data acquisition systems, serving maintenance and replacement needs for equipment built around Spartan-3 architecture where full PCB redesign for newer FPGAs would incur excessive cost and validation workload.
Alternative FPGA Solutions
● XC3S1000-5FT256I (Xilinx): Pin identical industrial temperature variant supporting -40°C to +100°C for harsh environment direct drop-in PCB substitution.
● XC6SLX100-2FT256C (Xilinx Spartan-6): Modern low-power FPGA with matching footprint and upgraded performance as a long-term upgrade replacement.
● LFE3-100EA-6FN256C (Lattice): Flash-based low-power FPGA with comparable logic density and compatible package as cross-brand second-source substitute.
