AMD XC3S1600E-4FGG400I

XC3S1600E-4FGG400I Spartan®-3E Field Programmable Gate Array (FPGA) IC

1. Overview & Core Specifications

The XC3S1600E-4FGG400I is a high-performance Field Programmable Gate Array (FPGA) from Xilinx's Spartan®-3E family, designed for cost-sensitive applications requiring robust logic density and advanced system integration. Built on a 90nm CMOS process, this device features 36,888 logic cells (CLBs) and 1,600,000 equivalent gates, enabling complex digital designs with minimal external components. It operates at a maximum clock frequency of 572 MHz with a CLB-max combinatorial delay of 0.76 ns, ensuring low-latency signal processing. The chip supports a wide voltage range (1.14V to 1.26V) and industrial-grade temperature tolerance (-40°C to 100°C), making it suitable for harsh environments like automotive or industrial automation. Its 400-pin FBGA (21x21 mm) package with a 1mm pitch provides high I/O density, supporting 304 user I/Os for flexible connectivity.

2. Architecture & Performance Features

The XC3S1600E-4FGG400I integrates 33,192 logic elements and 663,552 bits of distributed RAM, enabling efficient data buffering and real-time processing. It includes 16 dedicated 18x18 multipliers for high-speed DSP operations, such as filtering or encryption, and supports SelectIO™ technology for multi-voltage I/O standards (e.g., LVCMOS, LVDS). The device features Digital Clock Managers (DCMs) for precise clock synthesis and phase-locked loops (PLLs) to reduce jitter in high-speed interfaces. Its hierarchical SelectRAM+ memory architecture allows configurable block RAM (BRAM) for large data storage, while Xilinx ISE™ Design Suite compatibility simplifies FPGA programming via HDL (VHDL/Verilog) or schematic capture. The chip's low power consumption (1.2W typical) and RoHS-compliant, lead-free design align with green manufacturing standards.

3. Applications

The XC3S1600E-4FGG400I is widely deployed in embedded vision systems, where its high logic density and DSP capabilities process image data from cameras or sensors in real time. In industrial control, it manages motor drives, PLCs, and robotics with deterministic latency and multi-protocol support (e.g., Ethernet, CAN, SPI). The device excels in communication infrastructure, enabling software-defined radios (SDRs), baseband processing, and protocol bridging for 5G/LTE networks. Its automotive-grade reliability also supports ADAS modules, in-vehicle infotainment (IVI), and battery management systems (BMS). Additionally, its cost-effectiveness makes it ideal for consumer electronics, such as set-top boxes, gaming peripherals, and IoT gateways requiring flexible reconfiguration.

4. Alternative FPGA Models & Key Differences

● XC3S1600E-5FGG400C: A direct replacement with identical logic density (36,888 CLBs) and package (400-pin FBGA), but optimized for higher-speed applications with improved signal integrity.

● XC3S1600E-4FGG484CS1: Offers 484-pin FBGA packaging for expanded I/O (up to 336 pins) and additional BRAM, suitable for complex data-intensive tasks like video processing.

● XC3S1600E-4PQ208C: A smaller 208-pin PQFP package variant with reduced I/O (156 pins) but lower power consumption, ideal for space-constrained designs like portable medical devices.

● XC3S400E-4FT256C: A lower-cost alternative with 4,000 CLBs and 256-pin FT package, targeting low-complexity applications like simple motor controllers or LED displays.