AMD XC3S4000-4FGG900I
| Parameters | |
|---|---|
| Series | Spartan®-3 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | ROHS3 Compliant |
| Package / Case | 900-BBGA |
| Mfr | AMD |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Supplier Device Package | 900-FBGA (31x31) |
| Number of I/O | 633 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Number of Gates | 4000000 |
| Number of Logic Elements/Cells | 62208 |
| Number of LABs/CLBs | 6912 |
| Total RAM Bits | 1769472 |
| Package | Tray |
| Product Status | Active |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | XC3S4000 |
| REACH Status | REACH Unaffected |
| Standard Package | 27 |
| ECCN | 3A001A7A |
| HTSUS | 8542.39.0001 |
XC3S4000-4FGG900I Xilinx Spartan-3 FPGA, 4M gates FPGA Chip
The XC3S4000-4FGG900I is a high-performance FPGA (Field-Programmable Gate Array) from Xilinx’s Spartan®-3 series, designed for demanding digital logic applications. This device features 4 million system gates (equivalent to ~56,000 logic cells) and 1,728 Kbits of block RAM, making it ideal for high-speed data processing, telecommunications, and embedded systems. It operates at a core voltage of 1.2V with 4ns pin-to-pin delays, supporting clock frequencies up to 300 MHz for efficient real-time processing. The FPGA includes 502 user I/O pins with support for LVCMOS, LVTTL, HSTL, and SSTL standards, ensuring broad compatibility with various digital interfaces.
A key advantage of the XC3S4000-4FGG900I is its high logic density and flexible DSP capabilities, featuring 96 dedicated 18x18 multipliers for high-speed arithmetic operations in signal processing, video encoding, and networking applications. The device also supports multiple I/O standards, including DDR SDRAM interfaces, enabling seamless integration with external memory for data-intensive tasks. Additionally, it incorporates Digital Clock Managers (DCMs) for precise clock synchronization and global clock distribution, reducing timing skew in high-speed designs.
The XC3S4000-4FGG900I is housed in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package, providing a compact yet high-performance solution for complex PCB designs. It is reprogrammable in-system, allowing for firmware updates without hardware modifications, which is essential for prototyping and field upgrades. The FPGA is supported by Xilinx’s ISE Design Suite, offering a complete development environment for synthesis, simulation, and debugging. Its industrial temperature range (-40°C to +100°C) ensures reliable operation in harsh environments, making it suitable for military, aerospace, and industrial automation applications.
Digital signal processing FPGA Alternative Models:
● XC3S5000-4FGG900I – Higher logic capacity (5M system gates), more multipliers.
● XC3S2000-4FGG676C – Lower-cost variant (2M gates), smaller package.
● Altera Cyclone III EP3C40F484 – Competitor FPGA, similar logic density, lower power.
● Lattice ECP5-85F – Mid-range alternative, SERDES support, lower cost.
