XC3S400AN-4FGG400I
| Parameters | |
|---|---|
| Series | Spartan®-3AN |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | ROHS3 Compliant |
| Package / Case | 400-BGA |
| Mfr | AMD |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Supplier Device Package | 400-FBGA (21x21) |
| Number of I/O | 311 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Number of Gates | 400000 |
| Number of Logic Elements/Cells | 8064 |
| Number of LABs/CLBs | 896 |
| Total RAM Bits | 368640 |
| Package | Tray |
| Product Status | Active |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | XC3S400 |
| REACH Status | REACH Unaffected |
| Standard Package | 60 |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
XC3S400AN-4FGG400I Spartan®-3AN FPGA IC 311 368640 8064
The XC3S400AN-4FGG400I, manufactured by AMD, is a high-performance FPGA from the Spartan®-3AN family, featuring 400,000 system gates and 8,064 logic cells. Housed in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package, this device offers 311 user-configurable I/O pins and supports a wide range of I/O interface standards including HSTL, LVCMOS, LVTTL, and SSTL. Built on 90nm CMOS technology, the XC3S400AN-4FGG400I operates with a core supply voltage of 1.14V to 1.26V and is specified for the industrial temperature range of –40°C to +100°C.
The XC3S400AN-4FGG400I delivers 400,000 system gates with 8,064 logic cells organized into 896 Configurable Logic Blocks (CLBs), providing substantial programmable logic capacity for complex digital designs. Total RAM bits amount to 368,640 (45 kB), enabling efficient on-chip data storage and buffering. The device achieves a maximum operating frequency of 667 MHz and a speed grade of 4, supporting high-speed data processing and real-time control applications. It integrates Digital Clock Managers (DCMs) for flexible clock generation and phase shifting, ensuring robust timing management. The 311 I/O pins support multiple voltage levels from 1.2V to 3.3V, offering excellent design flexibility for mixed-voltage system interfaces. Built-in block RAM and distributed RAM provide flexible memory resources, while the device's 90nm process technology delivers a balanced combination of performance and power efficiency.
Alternative FPGA Parts
● XC3S400AN-4FGG400C – AMD Xilinx's commercial-temperature variant of the same Spartan®-3AN FPGA, offering identical 400K gates and 8064 logic cells in the 400-FBGA package for 0°C to 85°C applications.
● XC3S400A-4FGG400I – AMD Xilinx's Spartan®-3A family member featuring 400K gates and 8064 logic cells in a 400-FBGA package, with minor architectural differences from the -3AN variant.
● LCMXO3L-9400C-5BG400I – Lattice Semiconductor's MachXO3™ FPGA offering 9,400 LUTs and similar I/O count in a 400-ball BGA package, suitable as a drop-in alternative for many applications.
