AMD XC5VFX130T-3FFG1738C
| Parameters | |
|---|---|
| Base Product Number | XC5VFX130T |
| REACH Status | REACH Unaffected |
| Standard Package | 1 |
| ECCN | 3A001A7A |
| HTSUS | 8542.39.0001 |
| Series | Virtex®-5 FXT |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| RoHS Status | ROHS3 Compliant |
| Package / Case | 1738-BBGA, FCBGA |
| Mfr | AMD |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Supplier Device Package | 1738-FCBGA (42.5x42.5) |
| Number of I/O | 840 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Number of Logic Elements/Cells | 131072 |
| Number of LABs/CLBs | 10240 |
| Total RAM Bits | 10985472 |
| Package | Tray |
| Product Status | Active |
| Conevo-Key Programmable | Not Verified |
XC5VFX130T-3FFG1738C FPGA Chip
The XC5VFX130T-3FFG1738C is a high-performance Field-Programmable Gate Array (FPGA) from the Xilinx Virtex®-5 FXT family, engineered using advanced 65nm CMOS technology. This device features 131,072 logic cells organized into 10,240 Configurable Logic Blocks (CLBs), enabling parallel processing capabilities for demanding applications such as high-speed data communication, signal processing, and embedded systems. With a 1738-pin Flip-Chip Ball Grid Array (FCBGA) package, it supports 840 I/O channels, ensuring seamless integration with external hardware. The chip operates at a core voltage of 0.95V–1.05V, achieving a balance between power efficiency and performance, with a maximum static power consumption optimized for industrial-grade reliability. Its extended temperature range (0°C to 85°C) and RoHS compliance make it suitable for both commercial and ruggedized environments.
Key Technical Specifications
The XC5VFX130T-3FFG1738C integrates 10,985,472 bits of total RAM, distributed across embedded Block RAM (EBR) and distributed RAM, facilitating efficient data buffering and caching. It supports up to 8 high-speed transceivers, enabling data rates of 6.25 Gb/s for protocols like PCIe Gen2 and Aurora. The device’s 1,080 MHz maximum operating frequency ensures low-latency processing, while its 0.67 ns CLB delay enhances timing closure in high-speed designs. Additional features include adaptive logic modules (ALMs) for dynamic reconfiguration, 16 DSP48E1 slices for arithmetic operations, and a hierarchical clocking network with 16 global clock buffers. The FCBGA package (42.5mm x 42.5mm) supports surface-mount technology (SMT), enabling compact PCB layouts.
Alternative CMOS FPGA Models
● XC5VFX130T-1FFG1738C: A cost-optimized variant with identical logic cell count but reduced transceiver count (4 channels), suitable for mid-range applications.
● XC5VFX200T-2FFG1738C: Offers 196,608 logic cells and 960 I/Os, targeting high-density computing tasks like AI inference and financial trading algorithms.
● XC5VFX100T-3FFG1738C: A lower-density alternative with 102,400 logic cells and 680 I/Os, optimized for embedded vision and industrial automation.
● XC7K325T-2FFG900I: From the Kintex®-7 family, this model provides 326,080 logic cells and 16 transceivers, balancing performance and cost for cloud computing applications.
