XC6SLX25-2FGG484C
| Parameters | |
|---|---|
| Series | Spartan®-6 LX |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | ROHS3 Compliant |
| Package / Case | 484-BBGA |
| Mfr | AMD |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Supplier Device Package | 484-FBGA (23x23) |
| Number of I/O | 266 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Number of Logic Elements/Cells | 24051 |
| Number of LABs/CLBs | 1879 |
| Total RAM Bits | 958464 |
| Package | Tray |
| Product Status | Active |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | XC6SLX25 |
| REACH Status | REACH Unaffected |
| Standard Package | 60 |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
XC6SLX25-2FGG484C Field Programmable Gate Array (FPGA) IC 266 958464 24051 484-BBGA
The XC6SLX25-2FGG484C is a high-performance, low-power Field Programmable Gate Array (FPGA) from the AMD Spartan-6 family, featuring 24,051 logic cells and optimized for cost-sensitive, high-volume applications. Fabricated on a 45nm process technology, it delivers an optimal balance of performance, power efficiency, and logic density, with abundant resources including 4,680 slices (each containing four 6-input LUTs and eight flip-flops), 1,368 Kbits of fast block RAM, and 38 DSP48A1 slices for high-speed arithmetic operations. Housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package, the device supports a wide range of I/O standards, including LVCMOS, LVDS, and SSTL, with 348 user I/O pins. It operates with a core voltage of 1.2V, includes integrated DSP blocks and high-speed serial transceivers, and is rated for commercial temperature range (0°C to 85°C), making it ideal for bridging functionality between ASICs and microcontrollers in complex digital designs.
XC6SLX25-2FGG484C FPGA Applications
The XC6SLX25-2FGG484C is extensively deployed in applications demanding substantial digital signal processing and system integration, such as automotive infotainment and driver assistance systems, industrial automation and motor control, broadcast video processing and image capture, and communication infrastructure including software-defined radio and network bridging. Its robust I/O capabilities and embedded DSP slices also make it a prime choice for consumer electronics, medical imaging, and aerospace subsystems where flexible, high-performance logic consolidation is required.
Alternative FPGA Solutions
● Intel (Altera) Cyclone IV EP4CE22F17C8N: A cost-optimized FPGA featuring 22,320 logic elements and 154 embedded multipliers, offering a balanced profile for mid-range digital applications in a 256-pin FBGA package.
● Lattice Semiconductor ECP5-25F-6BG256C: A low-power, 25K LUT FPGA built on 40nm technology, known for its high DSP density and SERDES capabilities, ideal for power-sensitive communication designs.
● Microchip (Microsemi) IGLOO2 M2GL025-FGG484: A flash-based FPGA with 25K system gates, offering single-chip, low-static-power operation and high reliability for aerospace and industrial markets.
