XC7Z010-1CLG400I

XC7Z010-1CLG400I


  • Manufacturer: AMD
  • CONEVO NO: XC7Z010-1CLG400I
  • Package: 400-LFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: In stock
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Parameters
Series Zynq®-7000
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status ROHS3 Compliant
Package / Case 400-LFBGA, CSPBGA
Mfr AMD
Operating Temperature -40°C ~ 100°C (TJ)
Supplier Device Package 400-CSPBGA (17x17)
Speed 667MHz
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Number of I/O 130
Architecture MCU, FPGA
Peripherals DMA
Primary Attributes Artix™-7 FPGA, 28K Logic Cells
Flash Size -
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package Tray
Product Status Active
Base Product Number XC7Z010
REACH Status REACH Unaffected
Standard Package 90
ECCN 3A991D
HTSUS 8542.39.0001

XC7Z010-1CLG400I AMD Xilinx Zynq-7000 All Programmable SoC IC 28K Logic Cells 667MHz 

XC7Z010-1CLG400I is an industrial-temperature-grade hybrid SoC from AMD Xilinx Zynq-7000 lineup built on mature 28nm process, integrating dual-core ARM Cortex-A9 MPCore processing system (PS) and Artix-7 based programmable logic (PL) inside compact 17×17mm 400-pin CSPLFBGA packaging, rated for -40°C to +100°C junction operating range, 667MHz standard ARM core frequency, 28K PL logic cells alongside embedded block RAM and DSP slices, compliant with RoHS3 directives and MSL3 moisture standard for reliable automated SMT assembly in rugged industrial scenarios.

This unified SoC employs high-speed AXI bus architecture to enable seamless real-time data exchange between software-driven PS subsystem and hardware-reconfigurable PL fabric, where PS equips 256KB on-chip RAM plus rich native peripherals including Gigabit Ethernet, USB OTG, CAN, SPI, UART, I2C and SDIO interfaces, while PL supplies abundant configurable DSP resources for parallel algorithm acceleration, supporting flexible voltage configuration from core 1.0V to 3.3V I/O rail and customizable power-saving modes to cut overall system power draw for battery-powered embedded equipment.

Alternative FPGA SOC Models

● XC7Z020-1CLG400I (Xilinx): Pin-compatible 400-CSPBGA Zynq variant with identical PS architecture and upgraded 85K PL logic cells for projects needing expanded programmable resource without PCB redesign.

● XC7Z010-1CLG225I (Xilinx): Same dual-Cortex-A9 core configuration in smaller 225-ball LFBGA footprint to shrink finished board dimension for ultra-compact embedded product downsizing.

● PF50-100IQFN (Gowin): Domestic hybrid ARM+FPGA SoC with comparable peripheral sets as cross-brand second-source option during global original component supply shortages.

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