AMD XC7Z030-2FFG676I

XC7Z030-2FFG676I


  • Manufacturer: AMD
  • CONEVO NO: XC7Z030-2FFG676I
  • Package: 676-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
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Details

Tags

Parameters
Series Zynq®-7000
Moisture Sensitivity Level (MSL) 4 (72 Hours)
RoHS Status ROHS3 Compliant
Package / Case 676-BBGA, FCBGA
Mfr AMD
Operating Temperature -40°C ~ 100°C (TJ)
Supplier Device Package 676-FCBGA (27x27)
Speed 800MHz
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Number of I/O 130
Architecture MCU, FPGA
Peripherals DMA
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Flash Size -
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package Tray
Product Status Active
Base Product Number XC7Z030
REACH Status REACH Unaffected
Other Names 122-1888
Standard Package 1
ECCN 3A991D
HTSUS 8542.39.0001

XC7Z030-2FFG676I Dual ARM Cortex-A9 SOC IC 125K Logic Cells 800MHz

The XC7Z030-2FFG676I from AMD (formerly Xilinx) is a high-performance Zynq-7000 All Programmable System-on-Chip (SoC) that combines a dual-core ARM Cortex-A9 processing system with Xilinx 7-series Field Programmable Gate Array (FPGA) logic in a single 676-pin BGA package. This device represents a revolutionary architecture for embedded systems, offering the flexibility of programmable logic with the processing power of application-class processors, operating at industrial temperature grades (-40°C to +100°C). With its advanced processing capabilities and reconfigurable logic, the XC7Z030-2FFG676I is engineered for complex embedded applications requiring high-level computation, real-time processing, and custom hardware acceleration in industries ranging from aerospace and defense to industrial automation and automotive systems.

Key Features & Applications

This SoC features a dual-core ARM Cortex-A9 MPCore processor running at up to 1GHz with NEON co-processors and FPU units, supported by 512KB L2 cache and comprehensive peripherals including Gigabit Ethernet, USB, SDIO, and multiple UART/SPI/I2C interfaces. The FPGA fabric provides 125K logic cells, 6.8Mb block RAM, and 400 DSP slices with 25 x 18 multipliers, enabling implementation of complex digital signal processing algorithms and custom hardware functions. The device includes advanced memory interfaces supporting DDR3, DDR3L, and LPDDR2 with ECC protection, and features secure boot capabilities, dual quad-SPI flash controllers, and comprehensive power management with multiple power domains. Its programmable logic operates at 2.0V to 3.3V I/O voltages with support for numerous single-ended and differential I/O standards.

The XC7Z030-2FFG676I is extensively deployed in aerospace and defense systems for radar processing, encrypted communications, and avionics control systems requiring high reliability and processing performance. It serves as the computational heart in industrial automation for motor control, machine vision, and real-time processing in robotic systems. Automotive applications include advanced driver assistance systems (ADAS), in-vehicle infotainment, and vehicle networking systems. The device is also crucial in medical imaging equipment, broadcast video processing systems, and high-end scientific instruments where its combination of programmable logic and processing power enables unique system architectures and hardware-accelerated algorithms.

Alternative Programmable System-on-Chip Parts

● MPFS025T-FCG484I (Microchip Technology): A PolarFire SoC with 254K LE and quad 64-bit RISC-V cores offering low-power FPGA+processor integration.

● AGL030V5-VQFP100I (Microchip Technology): A low-density FPGA with embedded flash for simple control applications requiring programmability.

● STM32MP157C-DK2 (STMicroelectronics): An ARM Cortex-A7/M4 microprocessor with 3D GPU for general-purpose Linux-enabled embedded applications.

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