AMD XCKU085-2FLVA1517I
| Parameters | |
|---|---|
| Series | Kintex® UltraScale™ |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| RoHS Status | ROHS3 Compliant |
| Package / Case | 1517-BBGA, FCBGA |
| Mfr | AMD |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Supplier Device Package | 1517-FCBGA (40x40) |
| Number of I/O | 624 |
| Voltage - Supply | 0.922V ~ 0.979V |
| Number of Logic Elements/Cells | 1088325 |
| Number of LABs/CLBs | 62190 |
| Total RAM Bits | 58265600 |
| Package | Bulk |
| Product Status | Active |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | XCKU085 |
| REACH Status | REACH Unaffected |
| Standard Package | 1 |
| ECCN | 3A001A7B |
| HTSUS | 8542.39.0001 |
XCKU085-2FLVA1517I Xilinx UltraScale FPGA IC
The XCKU085-2FLVA1517I is a high-performance FPGA (Field-Programmable Gate Array) manufactured by Xilinx (now part of AMD), designed for advanced computing and signal processing applications. Built on the 20nm UltraScale™ architecture, this chip integrates 840,000 logic cells, 4,320 DSP slices, and 24.3 Mb of block RAM (BRAM), enabling it to handle complex algorithms with high throughput and low latency. It supports PCIe® Gen3 x8, 100G Ethernet, and DDR4 memory interfaces, making it ideal for data centers, 5G wireless infrastructure, and high-speed networking. The device is housed in a 1,517-pin Flip-Chip Ball Grid Array (FCBGA) package with a 15mm × 15mm footprint, optimized for space-constrained designs.
XCKU085-2FLVA1517I Applications
1. Data Center Acceleration: Offloading compute-intensive tasks like encryption, compression, and AI inference.
2. 5G Wireless Infrastructure: Supporting massive MIMO, beamforming, and fronthaul/backhaul processing.
3. Aerospace & Defense: Radar signal processing, secure communications, and electronic warfare systems.
4. High-Performance Computing (HPC): Accelerating scientific simulations and financial modeling.
5. Test & Measurement: Real-time signal analysis for oscilloscopes and spectrum analyzers.
Alternative FPGA Models
● XCKU095-2FFVA1156I: A higher-density variant with 930K logic cells and 5,520 DSP slices, suited for larger-scale AI workloads.
● XCKU035-1FFVA1156I: A cost-optimized version with 330K logic cells, ideal for mid-range networking and industrial automation.
● XCVU13P-2FHGA2104I: A Virtex UltraScale+™ FPGA with 1.3M logic cells and 6,840 DSP slices, targeting hyperscale data centers.
● XAZU7EG-1FFVB1156I: A Zynq UltraScale+™ MPSoC combining FPGA fabric with a quad-core ARM Cortex-A53 for embedded vision and edge computing.
