| Parameters | |
|---|---|
| Series | Kintex® UltraScale+™ |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| RoHS Status | ROHS3 Compliant |
| Package / Case | 784-BFBGA, FCBGA |
| Mfr | AMD |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Supplier Device Package | 784-FCBGA (23x23) |
| Number of I/O | 304 |
| Voltage - Supply | 0.698V ~ 0.876V |
| Number of Logic Elements/Cells | 474600 |
| Number of LABs/CLBs | 27120 |
| Total RAM Bits | 41984000 |
| Package | Tray |
| Product Status | Active |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | XCKU5 |
| Standard Package | 1 |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
XCKU5P-L1SFVB784I Kintex UltraScale+ FPGA IC 304 41984000 474600
The XCKU5P-L1SFVB784I is a high-performance, mid-range Field-Programmable Gate Array (FPGA) from AMD (Xilinx), belonging to the Kintex UltraScale+ family. Built on a 16nm FinFET process, it strikes an exceptional balance between logic capacity, DSP performance, and power efficiency. Housed in a compact 784-pin FCBGA (23x23mm) package, it operates over the industrial temperature range (-40°C to +100°C) with a core voltage supply of 0.698V to 0.876V. This device offers 474,600 logic cells, 1,056 DSP slices, and 15.8Mb (41,984Kb) of block RAM, making it a versatile solution for high-bandwidth, low-latency applications requiring hardware acceleration. It integrates 8 high-speed GTH transceivers and supports PCIe Gen3 x8, establishing itself as a cost-effective workhorse for 5G, industrial, and data center systems.
XCKU5P-L1SFVB784I Application Scenarios
● 5G Wireless Communications: 5G NR physical layer (PHY) processing, massive MIMO, and eCPRI fronthaul interfaces.
● Industrial Automation & Machine Vision: Real-time image processing, multi-axis motion control, and high-speed I/O control.
● Data Center Acceleration: Network function virtualization (NFV), storage acceleration, and high-frequency trading (HFT) logic.
● Test & Measurement: High-speed data acquisition, digital signal processing (DSP), and automated test equipment (ATE).
● Embedded Computing: High-performance embedded controllers, medical imaging, and aerospace/defense electronics.
Alternative Equivalent FPGA Models
1. Intel Arria 10 GT 10AX066H3F34E2HG: Mid-range FPGA with 440K logic elements, 1,156 DSP blocks, and 14.1Mb RAM, a direct competitor for high-speed communication and industrial applications.
2. Lattice ECP5-85K LFE5UM-85F-8BG756C: High-efficiency FPGA with 84K LUTs, 361 DSP slices, low power, ideal for cost-sensitive, small-form-factor industrial designs.
3. Microchip PolarFire MPF500T-1FCG1152I: 500K logic elements, 1,080 DSPs, 17.6Mb RAM, ultra-low power, and high reliability for aerospace and industrial control.
4. Xilinx XCKU3P-L1SFVB784I: Pin-compatible lower-density variant (300K logic cells), cost-reduced option for less resource-intensive applications.
5. Xilinx XCKU060-2FFVA1152I: Previous-gen Kintex UltraScale (20nm) FPGA, 480K logic cells, drop-in legacy alternative for existing system upgrades.