XCKU5P-L1SFVB784I

XCKU5P-L1SFVB784I


  • Manufacturer: AMD
  • CONEVO NO: XCKU5P-L1SFVB784I
  • Package: 784-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
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Tags

Parameters
Series Kintex® UltraScale+™
Moisture Sensitivity Level (MSL) 4 (72 Hours)
RoHS Status ROHS3 Compliant
Package / Case 784-BFBGA, FCBGA
Mfr AMD
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Supplier Device Package 784-FCBGA (23x23)
Number of I/O 304
Voltage - Supply 0.698V ~ 0.876V
Number of Logic Elements/Cells 474600
Number of LABs/CLBs 27120
Total RAM Bits 41984000
Package Tray
Product Status Active
Conevo-Key Programmable Not Verified
Base Product Number XCKU5
Standard Package 1
ECCN 3A991D
HTSUS 8542.39.0001

XCKU5P-L1SFVB784I Kintex UltraScale+ FPGA IC 304 41984000 474600 

The XCKU5P-L1SFVB784I is a high-performance, mid-range Field-Programmable Gate Array (FPGA) from AMD (Xilinx), belonging to the Kintex UltraScale+ family. Built on a 16nm FinFET process, it strikes an exceptional balance between logic capacity, DSP performance, and power efficiency. Housed in a compact 784-pin FCBGA (23x23mm) package, it operates over the industrial temperature range (-40°C to +100°C) with a core voltage supply of 0.698V to 0.876V. This device offers 474,600 logic cells, 1,056 DSP slices, and 15.8Mb (41,984Kb) of block RAM, making it a versatile solution for high-bandwidth, low-latency applications requiring hardware acceleration. It integrates 8 high-speed GTH transceivers and supports PCIe Gen3 x8, establishing itself as a cost-effective workhorse for 5G, industrial, and data center systems.

XCKU5P-L1SFVB784I Application Scenarios

● 5G Wireless Communications: 5G NR physical layer (PHY) processing, massive MIMO, and eCPRI fronthaul interfaces.

● Industrial Automation & Machine Vision: Real-time image processing, multi-axis motion control, and high-speed I/O control.

● Data Center Acceleration: Network function virtualization (NFV), storage acceleration, and high-frequency trading (HFT) logic.

● Test & Measurement: High-speed data acquisition, digital signal processing (DSP), and automated test equipment (ATE).

● Embedded Computing: High-performance embedded controllers, medical imaging, and aerospace/defense electronics.

Alternative Equivalent FPGA Models

1. Intel Arria 10 GT 10AX066H3F34E2HG: Mid-range FPGA with 440K logic elements, 1,156 DSP blocks, and 14.1Mb RAM, a direct competitor for high-speed communication and industrial applications.

2. Lattice ECP5-85K LFE5UM-85F-8BG756C: High-efficiency FPGA with 84K LUTs, 361 DSP slices, low power, ideal for cost-sensitive, small-form-factor industrial designs.

3. Microchip PolarFire MPF500T-1FCG1152I: 500K logic elements, 1,080 DSPs, 17.6Mb RAM, ultra-low power, and high reliability for aerospace and industrial control.

4. Xilinx XCKU3P-L1SFVB784I: Pin-compatible lower-density variant (300K logic cells), cost-reduced option for less resource-intensive applications.

5. Xilinx XCKU060-2FFVA1152I: Previous-gen Kintex UltraScale (20nm) FPGA, 480K logic cells, drop-in legacy alternative for existing system upgrades.

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