XCR3384XL-12PQG208C

XCR3384XL-12PQG208C


  • Manufacturer: AMD
  • CONEVO NO: XCR3384XL-12PQG208C
  • Package: 208-BFQFP
  • Datasheet: PDF
  • Stock: In stock
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Details

Tags

Parameters
Series CoolRunner XPLA3
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status ROHS3 Compliant
Package / Case 208-BFQFP
Mfr AMD
Mounting Type Surface Mount
Operating Temperature 0°C ~ 70°C (TA)
Supplier Device Package 208-PQFP (28x28)
Number of I/O 172
Number of Gates 9000
Programmable Type In System Programmable (min 1K program/erase cycles)
Voltage Supply - Internal 3V ~ 3.6V
Number of Logic Elements/Blocks 24
Delay Time tpd(1) Max 10.8 ns
Number of Macrocells 384
Package Tray
Product Status Obsolete
Conevo-Key Programmable Not Verified
Base Product Number XCR3384
REACH Status REACH Unaffected
Standard Package 24
ECCN EAR99
HTSUS 8542.39.0001

XCR3384XL-12PQG208C CPLD

The XCR3384XL-12PQG208C is a high-performance Complex Programmable Logic Device (CPLD) from Xilinx, belonging to the renowned CoolRunner XPLA3 family. This specific model is engineered to deliver advanced logic integration while maintaining extremely low power consumption, making it a superior choice for power-sensitive designs. It offers a high density of 384 macrocells, providing ample resources for implementing complex combinatorial and sequential logic functions. The CPLD operates at a core voltage of 3.3V and features a propagation delay of 12 nanoseconds, ensuring rapid signal processing suitable for high-speed applications. Housed in a 208-PQFP, the XCR3384XL-12PQG208C is designed for commercial temperature ranges (0°C to +85°C). 

The XCR3384XL-12PQG208C is ideally suited for a broad spectrum of applications across telecommunications, computing, industrial control, and consumer electronics. It is extensively used for high-performance glue logic, where it effectively replaces large quantities of standard 74-series logic chips to reduce board space and improve system reliability. In the telecommunications sector, this CPLD serves critical roles in line interfacing, protocol handling, and signal processing infrastructure. Industrial automation systems utilize the chip for complex state machine control and sensor interfacing, benefiting from its low EMI (Electromagnetic Interference) characteristics. Additionally, its low power profile makes it an excellent fit for portable instrumentation, medical devices, and handheld computing equipment that require high logic density without draining power reserves. It is also frequently employed in high-end computing peripherals for bus bridging and control logic aggregation between processors and memory subsystems.

Alternative CPLD Models

● ispMACH 4256V-75TN144C: Featuring a low-voltage, high-speed architecture, this Lattice device provides similar macrocell density and is known for its low standby current and robust in-system programmability.

● ATF1508ASV-15AU100: A 128-macrocell CPLD (smaller density) that serves as a pin-compatible drop-in replacement for less complex logic designs requiring high-speed performance and low power consumption.

● CY37064VP100-125AC: This CPLD is part of the Ultra37000 family, offering flash-based reprogrammability and in-system programming capabilities suitable for rapid prototyping and design iteration.

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