XCV600E-6FG676I
| Parameters | |
|---|---|
| Series | Virtex®-E |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | RoHS non-compliant |
| Package / Case | 676-BGA |
| Mfr | AMD |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Supplier Device Package | 676-FBGA (27x27) |
| Number of I/O | 444 |
| Voltage - Supply | 1.71V ~ 1.89V |
| Number of Gates | 985882 |
| Number of Logic Elements/Cells | 15552 |
| Number of LABs/CLBs | 3456 |
| Total RAM Bits | 294912 |
| Package | Tray |
| Product Status | Obsolete |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | XCV600E |
| REACH Status | REACH Unaffected |
| Standard Package | 1 |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
XCV600E-6FG676I Virtex-E FPGA IC 444 294912 15552 676-BGA
The XCV600E-6FG676I is a high-density, high-speed Virtex-E FPGA from Xilinx (now AMD) that embeds 74,496 logic cells (15552 CLBs), 294 k-bit block RAM and 444 user I/Os in a 27 mm 676-ball FCBGA package qualified for –40 °C to +100 °C industrial operation. Fabricated on a 0.18 µm, 1.8 V-core CMOS process, the device delivers 357 MHz fabric performance while supporting 3.3 V, 2.5 V and 1.8 V I/O standards, enabling glue-less interfacing to SDRAM, ZBT-SRAM and high-speed back-planes without external transceivers. Select-RAM™ blocks provide true dual-port 4 k-bit segments that can be cascaded for deeper FIFOs or cache lines, while dedicated carry logic and wide-function multiplexers accelerate 36-bit addition, barrel-shifters and wide-decoders at > 250 MHz.
Power-estimator data show 0.35 mW/MHz dynamic and 90 mW static consumption at 100 MHz, allowing fan-less operation in imaging and instrumentation cards. The 676-ball footprint offers 444 single-ended or 222 differential pairs, supporting 840 Mb/s LVDS and 200 MHz SSTL-2, giving designers ample bandwidth for DDR-200 memory or parallel ADC interfaces while maintaining signal integrity through low-inductance BGA escapes.
Alternative FPGA Models
● Xilinx XC3S500E-4FGG676C: Spartan-3E, 104 k logic cells, 250 MHz, 1.2 V, 676-ball, lower cost for consumer imaging.
● Intel EP4SGX70HF35C2G: Stratix IV GX, 70 k ALMs, 12 × 3.2 Gb/s transceivers, 40 nm, when multi-gigabit serial links are mandatory.
● Lattice LFE5UM-85F-8BG756C: 85 k LUTs, 4 × 3.2 Gb/s SERDES, 28 nm FD-SOI, low-power edge-AI alternative.
● Microsemi RTG4 RT4G150: 150 k LUTs, radiation-tolerant flash, 24 × 5 Gb/s lanes, for space-grade SDR or satellite payloads.
● AMD XC7A75T-1FGG484I: Artix-7, 75 k cells, 8 × 6.6 Gb/s GTX, 28 nm, drop-in 484-ball upgrade for lower power and higher speed.
