AMD XCZU47DR-2FFVE1156I
| Parameters | |
|---|---|
| Series | Zynq® UltraScale+™ RFSoC |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| RoHS Status | ROHS3 Compliant |
| Package / Case | 1156-BBGA, FCBGA |
| Mfr | AMD |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Supplier Device Package | 1156-FCBGA (35x35) |
| Speed | 533MHz, 1.333GHz |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| RAM Size | 256KB |
| Number of I/O | 366 |
| Architecture | MCU, FPGA |
| Peripherals | DMA, WDT |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells |
| Flash Size | - |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Package | Tray |
| Product Status | Active |
| Other Names | 122-XCZU47DR-2FFVE1156I |
| Standard Package | 1 |
XCZU47DR-2FFVE1156I FPGA SoC ARM Cortex-A53 Processor
The XCZU47DR-2FFVE1156I from AMD (formerly Xilinx) is a high-performance Zynq UltraScale+ MPSoC that integrates a 64-bit quad-core ARM Cortex-A53 application processing unit, a dual-core ARM Cortex-R5 real-time processing unit, and an UltraScale architecture programmable logic fabric in a single device. This heterogeneous multi-processor system-on-chip delivers exceptional computational power with 1.3 million logic cells, 3,600 DSP slices, and 32.1 Mb of block RAM, making it ideal for advanced embedded systems requiring both high-performance processing and hardware acceleration. Housed in a 1156-ball flip-chip BGA package, the device operates at industrial temperature grades (-40°C to +100°C) and supports multiple power domains with advanced power management capabilities. The XCZU47DR-2FFVE1156I targets applications in 5G wireless infrastructure, automotive ADAS, industrial IoT, and aerospace systems where the combination of software programmability and hardware customization enables optimal system performance and power efficiency.
XCZU47DR-2FFVE1156I Key Features
This MPSoC features a comprehensive processing subsystem with the ARM Cortex-A53 cluster operating at up to 1.5 GHz and the Cortex-R5 dual-core lockstep configuration for safety-critical applications, supported by a Mali-400 MP2 graphics processing unit for display and video acceleration. The programmable logic fabric utilizes 16 nm FinFET technology, delivering high-performance logic integration with 5,520 Kb of distributed RAM and advanced clock management tiles with mixed-mode clock managers. Integrated peripherals include PCIe Gen3 x16, SATA 3.1, DisplayPort, USB 3.0, multiple GbE interfaces, and comprehensive security features with RSA-4096 authentication and AES-GCM decryption. The device incorporates 4 GB of DDR4/LPDDR4 memory support, error correction codes, and hardware memory protection units, while consuming less than 30 W typical power with advanced power gating and dynamic voltage frequency scaling capabilities.
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