XCZU4EG-2FBVB900E
| Parameters | |
|---|---|
| Series | Zynq® UltraScale+™ MPSoC EG |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| RoHS Status | ROHS3 Compliant |
| Package / Case | 900-BBGA, FCBGA |
| Mfr | AMD |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Supplier Device Package | 900-FCBGA (31x31) |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAM Size | 256KB |
| Number of I/O | 204 |
| Architecture | MCU, FPGA |
| Peripherals | DMA, WDT |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| Flash Size | - |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Package | Tray |
| Product Status | Active |
| Base Product Number | XCZU4 |
| REACH Status | REACH Unaffected |
| Standard Package | 1 |
| ECCN | 5A002A4 XIL |
| HTSUS | 8542.39.0001 |
XCZU4EG-2FBVB900E Zynq UltraScale+ MPSoC FPGA 533MHz 1.3GHz
The XCZU4EG-2FBVB900E is a high-performance Zynq® UltraScale+™ MPSoC from AMD Xilinx, integrating a quad-core ARM® Cortex®-A53, dual-core Cortex™-R5 real-time processor, and ARM Mali™-400 MP2 GPU with advanced FPGA logic. Part of the EG series, it features over 192K logic units, 256KB on-chip RAM, and 204 I/O pins, supporting diverse peripherals including CANbus, Ethernet, I²C, SPI, and USB OTG for flexible system integration. Operating at speeds up to 1.3GHz (A53), 600MHz (R5), and 533MHz (GPU), it combines software programmability with hardware acceleration, ideal for embedded systems requiring high processing power and real-time performance. Housed in a 900-pin FCBGA (31x31mm) package, it is RoHS3-compliant and designed for commercial and industrial applications demanding compact, high-density integration.
Operating across a 0°C to 100°C junction temperature range, the XCZU4EG-2FBVB900E uses a nominal 0.85V core supply voltage (0.825V-0.876V range) to balance performance and power efficiency. It supports high-speed I/O standards, features DMA and WDT peripherals, and offers robust ESD protection for reliable operation in noisy environments. With a moisture sensitivity level (MSL) of 4 (72 hours), it meets strict industrial reliability standards, supports peak reflow temperatures up to 245°C, and ensures stable performance in long-term operation. The device is REACH-compliant, uses Sn96.5/Ag3.0/Cu0.5 terminal finish, and delivers low power consumption for energy-efficient embedded designs.
Alternative FPGA Models
● AMD Xilinx XCZU5EV-1FFVC1156E: UltraScale+ MPSoC with enhanced FPGA logic, compatible architecture, ideal for higher-performance industrial applications.
● AMD Xilinx XCZU3EG-1SFVC769E: Lower-cost EG series variant with similar processor core, smaller FCBGA package for compact designs.
● Intel Stratix 10 GX 10M: FPGA-based alternative with high logic density and fast transceiver speeds, suitable for high-performance computing.
● Microchip PolarFire MPF300TS-FCG1152I: RISC-V based MPSoC, low-power substitute with robust industrial temperature support and similar I/O capabilities.
