| Parameters |
| Mfr |
Analog Devices Inc./Maxim Integrated |
| Series |
- |
| Package |
Tray |
| Product Status |
Obsolete |
| Function |
TDM-over-Packet (TDMoP) |
| Interface |
TDMoP |
| Number of Circuits |
1 |
| Voltage - Supply |
1.8V, 3.3V |
| Current - Supply |
- |
| Operating Temperature |
-40°C ~ 85°C |
| Mounting Type |
Surface Mount |
| Package / Case |
676-BGA |
| Supplier Device Package |
676-TEPBGA (27x27) |
| Base Product Number |
DS34S132 |
| RoHS Status |
ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| REACH Status |
REACH Unaffected |
| ECCN |
EAR99 |
| HTSUS |
8542.39.0001 |
| Standard Package |
1 |
Telecom IC TDM-over-Packet (TDMoP) 676-TEPBGA (27x27)